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THE CRYSTALLINE QUALITY OF Si FILMS PREPARED BY THERMAL-AND PHOTO-CVD AT LOW TEMPERATURES
Korean Journal of Chemical Engineering, November 1995, 12(5), 593-596(4), 10.1007/BF02705867
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Abstract
Various silicon films were prepared by thermal-and UV photo-CVD processes. The reactants were SiH4, SiH2F2, SiF4, and H2. Silicon films grown at temperatures below 500℃ were either amorphous or crystalline depending on the process conditions, and the growth rates ranged between 5 and 80Å/min. The film obtained by photo-CVD using fluoro-silanes as the reactants was crystalline even when the deposition temperature was as low as 250℃. Analyses of the film by RBS, SIMS, XRD, and ex-situ IR indicated that the film grown from silanes was contaminated by oxygen and other impurities while one from fluoro-silanes was relatively low in the impurities. The film crystallinity was higher in the latter case than the former.
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References
Brodsky MH, Cardona M, Cuomo JJ, Phys. Rev., B, Condens. Matter, 16, 3556 (1977)
Donahue TJ, Reif R, J. Appl. Phys., 57, 2757 (1985)
Falcony C, Ortiz A, Lopez S, Alonso JC, Muhl S, Thin Solid Films, 199, 269 (1991)
Hamasaki T, Ueda M, Chayahara A, Hirose M, Osaka Y, Appl. Phys. Lett., 44, 600 (1984)
Marvilie L, Reif R, J. Appl. Phys., 72, 3641 (1992)
Masson D, Paquin L, Poulin-Dandurand S, Sacher E, Yelon A, J. Non-Cryst. Solids, 66, 93 (1984)
Matsuda A, J. Non-Cryst. Solids, 59-60, 767 (1983)
Meyerson BS, Appl. Phys. Lett., 48, 797 (1986)
Nishida S, Konagai M, Takahashi K, Thin Solid Films, 112, 7 (1984)
Ota Y, J. Electrochem. Soc., 126, 1761 (1979)
Shibada N, Fukuda K, Ohtoshi H, Hanna J, Ota S, Shimizu I, Jpn. J. Appl. Phys., 26, L10 (1987)
Shimada T, Katayama Y, Hirigome S, Jpn. J. Appl. Phys., 19, L265 (1980)
Yabumoto N, Saito K, Morita M, Ohmi T, Jpn. J. Appl. Phys., 30, L419 (1991)
Donahue TJ, Reif R, J. Appl. Phys., 57, 2757 (1985)
Falcony C, Ortiz A, Lopez S, Alonso JC, Muhl S, Thin Solid Films, 199, 269 (1991)
Hamasaki T, Ueda M, Chayahara A, Hirose M, Osaka Y, Appl. Phys. Lett., 44, 600 (1984)
Marvilie L, Reif R, J. Appl. Phys., 72, 3641 (1992)
Masson D, Paquin L, Poulin-Dandurand S, Sacher E, Yelon A, J. Non-Cryst. Solids, 66, 93 (1984)
Matsuda A, J. Non-Cryst. Solids, 59-60, 767 (1983)
Meyerson BS, Appl. Phys. Lett., 48, 797 (1986)
Nishida S, Konagai M, Takahashi K, Thin Solid Films, 112, 7 (1984)
Ota Y, J. Electrochem. Soc., 126, 1761 (1979)
Shibada N, Fukuda K, Ohtoshi H, Hanna J, Ota S, Shimizu I, Jpn. J. Appl. Phys., 26, L10 (1987)
Shimada T, Katayama Y, Hirigome S, Jpn. J. Appl. Phys., 19, L265 (1980)
Yabumoto N, Saito K, Morita M, Ohmi T, Jpn. J. Appl. Phys., 30, L419 (1991)