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TPR STUDY OF ELECTROLESS PLATED COPPER CATALYSTS
Korean Journal of Chemical Engineering, September 1998, 15(5), 559-562(4), 10.1007/BF02707110
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Abstract
An electroless copper plating method, an impregnation method, and a precipitation method were used to prepare copper/alumina catalysts with different loadings. Temperature-programmed reduction (TPR) was employed to characterize the reducibility of copper catalysts prepared by different methods. The experimental results showed that the copper catalyst prepared by electroless plating method had the lowest reduction temperature, followed by the catalyst prepared by the precipitation method, and the catalyst prepared by the impregnation method had the highest reduction temperature.
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References
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Chang HF, Saleque MA, Appl. Catal. A: Gen., 103, 233 (1993)
Chang HF, Saleque MA, Hsu WS, Lin WH, J. Mol. Catal., 109, 249 (1996)
Chang HF, Saleque MA, Hsu WS, Lin WH, J. Mol. Catal., 94, 233 (1994)
El-Raghy SM, Abo-Salama AA, J. Electrochem. Soc., 126, 171 (1979)
Jenkins JW, McNicol BD, Robertson SD, "Characterized Catalysts via Temperature-Programmed Reduction," CHEMTECH, 317 (1977)
Kikuchi H, Tomizawa A, Oka H, U.S. Patent, 4,563,217 (1986)
LoJacono M, Cimino A, Inversi M, J. Catal., 76, 320 (1982)
Monti DAM, Baiker A, J. Catal., 83, 323 (1983)
Sivaraj C, KantaRao P, Appl. Catal., 45, 103 (1988)
Sivaraj C, Reddy BP, Rao BR, KantaRao P, Appl. Catal., 24, 25 (1986)
Sivaraj C, Srinivas ST, Rao VN, KantaRao P, J. Mol. Catal., 60, L23 (1990)
Strohmeier BR, Leyden DE, Field RS, Hercules DM, J. Catal., 91, 514 (1985)
Tikhov SF, Sadykov VA, Kryukova GN, Paukshtis EA, Popovskii VV, Starostina TG, Kharlamov GV, Anufrienko VF, Poluboyarov VF, Razdobarov VA, Bulgakov NN, Kalinkin AV, J. Catal., 134, 506 (1992)
