Articles & Issues

Language: English

Conflict of Interest: In relation to this article, we declare that there is no conflict of interest.

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

All issues

Design for Control: Temperature Uniformity in Rapid Thermal Processor

Ian Huang Hsin-Heng Liu Cheng-Ching Yu^†

Department of Chemical Engineering, National Taiwan University of Sci. Technol., 43 Keelung Rd., Sec. 4, Taipei 106-07, Taiwan

Korean Journal of Chemical Engineering, January 2000, 17(1), 111-117(7), 10.1007/BF02789263

Download PDF

Abstract

It is well known that the design of the heating source imposes an inherent limitation on the performance of the rapid thermal processor (RTP). In this work, the similarities and differences between flat and angled reflectors are studied. The discontinuous characteristic of the angled reflector can be used to compensate for the edge that loss of the thin wafer and, consequently, a better temperature uniformity can be achieved. A design procedure is proposed to place the lamp ring as well as the angle of the reflectors. For the control system design, the measurement selection criterion of Huang et al. is employed to find candidate measurement sets followed by a structured singular value criterion. Once the control structure is determined, multivariable temperature controllers were designed according to the internal model control (IMC) principle. From porcess insight, a farily simple nonlinear compensation is also devised. Simulation results show that while only half of the thermal budget is used improved temperature uniformity can be obtained by using proposed approach.

Keywords

Rapid Thermal Processor Temperature Control Temperature Uniformity Thermal Stress Analysis Design for Control

References

Apte PP, Saraswat KC, IEEE Trans. Semicond. Manuf., 5, 180 (1992)
Badwell TA, Breedijk T, Bushman SG, Butler SW, Chatterjee S, Edgar TF, Toprac AJ, Trachtenberg I, Comput. Chem. Eng., 19(1), 1 (1995)
Cho YM, Kailath T, IEEE Trans. Semicond. Manuf., 6, 233 (1993)
Crowley JL, DeBolski TJ, Kermani A, Lassing SE, U.S. Patent, 4,755,654 (1988)
Dilhac JM, Nolhier N, Ganibal C, Zanchi C, IEEE Trans. Semicond. Manuf., 8, 432 (1995)
Fan YH, Qiu T, IEEE Trans. Semicond. Manuf., 10, 433 (1997)
Gyurcsik RS, Riley TJ, Sorrell FY, IEEE Trans. Semicond. Manuf., 4, 9 (1991)
Huang CJ, Yu CC, Shen SH, IEEE Trans. Semicond. Manuf., (revised) (1999)
Huang CJ, Yu CC, Shen SH, Automatica, (in press), 36 (2000)
Huang I, "Control of Rapid Thermal Processor: Design for Temperature Uniformity," MS Thesis, National Taiwan University of Sci. Technol., Taipei (1997)
Hebb JP, Jensen KF, IEEE Trans. Semicond. Manuf., 11, 99 (1998)
Lord HA, IEEE Trans. Semicond. Manuf., 1, 105 (1988)
Merchant TP, Cole JV, Knutson KL, Hebb JP, Jensen KF, J. Electrochem. Soc., 143(6), 2035 (1996)
Morari M, Zafiriou E, "Robust Process Control," Prentice-Hall, Englewood Cliff, NJ (1989)
National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA, Dec. (1994)
Norman SA, IEEE Trans. Electron Devices, 39, 205 (1992)
Roozeboom F, "Manufacturing Equipment Issues in Rapid Thermal Processing," Academic Press, New York (1992)
Sachs E, Guo R, Ha S, Hu A, IEEE Trans. Semicond. Manuf., 4, 134 (1991)
Sorrell FY, Harris JA, Gyurcsik RS, IEEE Trans. Semicond. Manuf., 3, 183 (1990)
Stuber JD, Trachtenberg I, Edgar TF, IEEE Trans. Semicond. Manuf., 11, 442 (1998)