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Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Dept. of Chem. Eng., Pusan National Univ., Pusan 609-735, Korea 1Division of Quatum Metrology, Korea Research Institute of Standards and Science, Taejon 305-600, Korea
Korean Journal of Chemical Engineering, January 2000, 17(1), 41-46(6), 10.1007/BF02789251
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Abstract
Highly thermal conductive EMCs (Exopy Molding Compounds) should be considered for the alleviation of thermal stress-related problems caused by low thermal conductivity, and high elastic modulus of EMCs and by a mismatch of CTE (Coefficient of Thermal Expansion) between EMCs and the Si-wafer. Compared to crystalline silica-filled EMCs, alumina filed EMC improved the value of thermal conductivity by 100% and lowered the value of CTE by 50%. As a result, compared to typical crystalline silica-filled EMCs, the thermal fatigue resistance of alumina-filled EMC was improved by sixfold.
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