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Received July 8, 2002
Accepted September 6, 2002
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Analysis of Particle Contamination in Plasma Reactor by 2-Sized Particle Growth Model
Department of Chemical Engineering, Kangwon National University, Chuncheon, Kangwon-Do 200-701, Korea 1Department of Environmental Engineering, Semyung University, San 21-1, Sinwol-Dong, Jechon, Chungbuk 390-230, Korea
Korean Journal of Chemical Engineering, March 2003, 20(2), 392-398(7), 10.1007/BF02697257
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Abstract
Rapid particle growth in the silane plasma reactor by coagulation between 2-sized particles was analyzed for various process conditions. The particle coagulation rate was calculated considering the effects of particle charge distribution based on the Gaussian distribution function. The large size particles are charged more negatively than the small size particles. Some fractions of small size particles are in neutral state or charged positively, depending on the_x000D_
plasma conditions. The small size particle concentration increases at first and decreases later and reaches the steady state by the balance of generation rate and coagulation rate. The large size particles grow with discharge time by coagulation with small size particles and their size reaches the steady state, while the large size particle concentration increases with discharge time by faster generation rate and reaches the steady state by the balance of generation and_x000D_
disappearance rates. As the diameter of small size particles decreases, the diameter of large size particles increases more quickly by the faster coagulation with small size particles of higher concentration. As the residence time increases, the concentration and size of large size particles increase more quickly and the average charges per small size and large size particle decrease.
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References
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Childs MA, Gallagher A, J. Appl. Phys., 87, 1076 (2000)
Friedlander SK, "Smoke, Dust and Haze," Wiley-Interscience, New York (1977)
HoranyiM, Goertz CK, Astrophys. J., 361, 155 (1990)
Howling AA, Sansonnens L, Dorier JL, Hollenstein C, J. Phys. D: Appl. Phys., 26, 1003 (1993)
Hung FY, Kushner MJ, J. Appl. Phys., 81(9), 5960 (1997)
Kim DJ, Kim KS, AIChE J., 48(11), 2499 (2002)
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Kim DJ, Kim KS, Aerosol Sci. Technol., 32, 293 (2000)
Kim KS, Ikegawa M, Plasma Sources Sci. Technol., 5, 311 (1996)
Kortshagen U, Bhandarkar U, Phys. Rev. E, 60(1), 887 (1999)
Lieberman MA, Lichtenberg AJ, "Principles of Plasma Discharges and Materials Processing," Wiley-Interscience, New York (1994)
Matsoukas T, Russell M, Smith M, J. Vac. Sci. Technol. A, 14(2), 624 (1996)
Riggs JB, "An Introduction to Numerical Methods for Chemical Engineers," Texas Tech University Press, Texas (1988)
Selwyn GS, Plasma Sources Sci. Technol., 3, 340 (1994)
Selwyn GS, Semicond. Int., 16, 72 (1993)
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Watanabe Y, Plasma Phys. Control. Fusion, 39, A59 (1997)