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In relation to this article, we declare that there is no conflict of interest.
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Received January 21, 2003
Accepted April 14, 2003
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Patterning Si by Using Surface Functionalization and Microcontact Printing with a Polymeric Ink

Department of Chemistry, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Korea 1Division of Chemistry and Chemical Engineering, Kyungnam University, Masan, Kyungnam 631-701, Korea
ischoi@kaist.ac.kr
Korean Journal of Chemical Engineering, September 2003, 20(5), 956-959(4), 10.1007/BF02697305
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Abstract

This paper describes a simple procedure for patterning Si substrate using a combination of surface functionalization and microcontact printing (μCP). The Si/SiO2 surfaces were chemically modified to present self-assembled monolayers (SAMs) of siloxanes terminating in reactive carboxylic anhydride groups and then patterned with poly(ethylene imine) (PEI) by μCP. We used the patterned thin films of PEI as etch resists on Si surfaces.

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