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Conflict of Interest: In relation to this article, we declare that there is no conflict of interest.

Publication history: Received August 23, 2023
Accepted August 23, 2023

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Submicron Patterning of Ta, NiFe, and Pac-man Type Ta/NiFe/Ta Magnetic Elements

Hyun-Wook Ra Kwang Sup Song¹ Yoon-Bong Hahn^†

School of Chemical Engineering and Technology, Nanomaterials Processing Research Center, Chonbuk National University, Chonju 561-756, Korea ¹Korea Institute of Energy Research, Daejeon 305-343, Korea

Korean Journal of Chemical Engineering, September 2005, 22(5), 793-796(4), 10.1007/BF02705801

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Abstract

Submicron patterning of Ta, NiFe, and Pac-man type magnetic elements of Ta/NiFe/Ta has been carried out in inductively coupled plasmas (ICPs) of Cl2/Ar. Etch behavior was quite dependent on materials and plasma parameters. An ion-enhanced etch mechanism played a critical role for desorption of metal chloride etch products. Sidewall contamination with etch products was observed at a higher Cl2 concentration (>50%). Compared to relatively damaged surfaces and profiles by the ion milling method, the ICP etching technique produced clear, smooth, and well-defined Pac-man type elements.

Keywords

Magnetic Elements Submicron Patterning Dry Etching Pac-man Type

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