ISSN: 0256-1115 (print version) ISSN: 1975-7220 (electronic version)
Copyright © 2024 KICHE. All rights reserved

Articles & Issues

Language
English
Conflict of Interest
In relation to this article, we declare that there is no conflict of interest.
Publication history
Received September 29, 2005
Accepted December 29, 2005
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.

All issues

Plasma modification on a Nafion membrane for direct methanol fuel cell applications

Department of Chemical and Materials Engineering, Chang Gung University, Taoyuan, Taiwan 1Department of Chemical Engineering, Chung Yuan University, Taoyuan, Taiwan
jessie@mail.cgu.edu.tw
Korean Journal of Chemical Engineering, May 2006, 23(3), 441-446(6), 10.1007/BF02706747
downloadDownload PDF

Abstract

This research focuses on Nafion modification using plasma techniques for direct methanol fuel cell applications. The results indicated the both argon (Ar) and carbon tetrafluoride (CF4) plasma treatments modified the Nafion surface substantially without altering the bulk properties. The Nafion surface exposed to CF4 plasma resulted in a more hydrophobic layer and an even lower MeOH permeability than the Ar-treated membrane. The plasma operating conditions using CF4 were optimized by utilizing an experimental design. The minimum MeOH permeability was reduced by 74%. The conductivity was 1-2×10-3 S/cm throughout the entire experimental range. Suppressed MeOH permeability can be achieved while maintaining the proton conductivity at a satisfactory level by adjusting the plasma operating conditions.

References

DAgostino R, Cramarossa F, Fracassi F, De Simoni E, Sabbatini L, Zambonin PG, Caporiccio G, Thin Solid Films, 143, 163 (1986) 
ASTM, Annual book of ASTM standards, Designation D 638-91: Standard test method for tensile properties of plastics, American Society for Testing and Materials, West Conshohocken, PA, USA (1994)
Carretta N, Tricoli V, Picchioni F, J. Membr. Sci., 166(2), 189 (2000) 
Choi WC, Kim JD, Woo SI, J. Power Sources, 96(2), 411 (2001) 
DuPont, Dupont Nafion PFSA Membranes. Product Information NAE101, Fayetteville, North Carolina, USA. p.2, Feb. (2004)
Elabd YA, Napadensky E, Sloan JM, Crawford DM, Walker CW, J. Membr. Sci., 217(1-2), 227 (2003) 
Damay F, Klein LC, Solid State Ion., 162, 261 (2003)
Feichtinger J, Galm R, Walker M, Baumgartner KM, Schulz A, Rauchle E, Schumacher U, Surf. Coat. Technol., 142, 181 (2001) 
Heinzel A, Barragan VM, J. Power Sources, 84(1), 70 (1999) 
Hobson LJ, Ozu H, Yamaguchi M, Hayase S, J. Electrochem. Soc., 148(10), A1185 (2001) 
Kim B, Kwon KH, Kwon SK, Park JM, Yoo SW, Park KS, You IK, Kim BW, Thin Solid Films, 426(1-2), 8 (2003) 
Kim J, Kim B, Jung B, J. Membr. Sci., 207(1), 129 (2002) 
Lee S, Kim D, Lee J, Chung ST, Ha HY, Korean J. Chem. Eng., 22(3), 406 (2005)
Li L, Zhang J, Wang YX, J. Membr. Sci., 226(1-2), 159 (2003) 
Lue SJJ, Juang HJ, Hou SY, Sep. Sci. Technol., 37(2), 463 (2002) 
Lue SJ, Shih TS, Wei TC, “Surface modification on a Nafion membrane under Ar and CF4 plasmas,” in preparation (2006)
Ma ZQ, Cheng P, Zhao TS, J. Membr. Sci., 215(1-2), 327 (2003) 
Manea C, Mulder M, J. Membr. Sci., 206(1-2), 443 (2002) 
Montgomery DC, Design and analysis of experiments, fifth ed., John Wiley, New York (2001)
Pak C, Lee SJ, Lee SA, Chang H, Korean J. Chem. Eng., 22(2), 214 (2005)
Sauk J, Byun J, Kang Y, Kim H, Korean J. Chem. Eng., 22(4), 605 (2005)
Scott K, Taama WM, Argyropoulos P, J. Membr. Sci., 171(1), 119 (2000) 
Walker M, Baumgartner KM, Feichtinger J, Kaiser N, Rauchle E, Kerres J, Surf. Coat. Technol., 116, 996 (1999) 
Woo Y, Oh SY, Kang YS, Jung B, J. Membr. Sci., 220(1-2), 31 (2003) 
Yin Y, Fang JH, Cui YF, Tanaka K, Kita H, Okamoto K, Polymer, 44(16), 4509 (2003) 
Zeng R, Pang ZC, Zhu HS, J. Electroanal. Chem., 490(1-2), 102 (2000) 

The Korean Institute of Chemical Engineers. F5, 119, Anam-ro, Seongbuk-gu, 233 Spring Street Seoul 02856, South Korea.
TEL. No. +82-2-458-3078FAX No. +82-507-804-0669E-mail : kiche@kiche.or.kr

Copyright (C) KICHE.all rights reserved.

- Korean Journal of Chemical Engineering 상단으로