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- In relation to this article, we declare that there is no conflict of interest.
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Received November 29, 2005
Accepted February 3, 2006
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This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits
unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.
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Fabrication of high aspect ratio nanostructures using capillary force lithography
School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Korea
Korean Journal of Chemical Engineering, July 2006, 23(4), 678-682(5), 10.1007/BF02706814
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Abstract
A new ultraviolet (UV) curable mold consisting of functionalized polyurethane with acrylate group (MINS101m, Minuta Tech.) has recently been introduced as an alternative to replace polydimethylsiloxane (PDMS) mold for sub-100-nm lithography. Here, we demonstrate that this mold allows for fabrication of various high aspect ratio nanostructures with an aspect ratio as high as 4.4 for 80 nm nanopillars. For the patterning method, we used capillary force lithography (CFL) involving direct placement of a polyurethane acrylate mold onto a spin-coated polymer film followed by raising the temperature above the glass transition temperature of the polymer (Tg). For the patterning materials, thermoplastic resins such as polystyrene (PS) and poly(methyl methacrylate) (PMMA) and a zinc oxide (ZnO) precursor were used. For the polymer, micro/nanoscale hierarchical structures were fabricated by using sequential application of the same method, which is potentially useful for mimicking functional surfaces such as lotus leaf.
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Kim YS, Suh KY, Lee HH, Appl. Phys. Lett., 79, 2285 (2001)
Krauss PR, Chou SY, Appl. Phys. Lett., 71, 3174 (1997)
Lee KB, Kim DJ, Yoon KR, Kim Y, Choi IS, Korean J. Chem. Eng., 20(5), 956 (2003)
Lee KB, Park S, Mirkin CA, Smith JC, Mrksich M, Science, 295, 1702 (2002)
Neinhuis C, Barthlott W, Ann. Bot., 79, 667 (1997)
Odom TW, Love JC, Wolfe DB, Paul KE, Whitesides GM, Langmuir, 18(13), 5314 (2002)
Poborchii VV, Tada T, Kanayama T, Appl. Phys. Lett., 75, 3276 (1999)
Schmid H, Michel B, Macromolecules, 33(8), 3042 (2000)
Seo SM, Park JY, Lee HH, Appl. Phys. Lett., 86(13) (2005)
Suh KY, Kim YS, Lee HH, Adv. Mater., 13, 1386 (2001)
Suh KY, Langer R, Lahann J, Appl. Phys. Lett., 83, 4250 (2003)
Suh KY, Lee HH, Adv. Funct. Mater., 12, 405 (2002)
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Wu S, Polymer Interface and Adhesion, Dekker, New York (1982)
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Yang SM, Ozin GA, Chem. Commun., 24, 2507 (2000)
