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In relation to this article, we declare that there is no conflict of interest.
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Received October 26, 2005
Accepted March 17, 2006
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Influence of sputtering gas pressure on the LiCoO2 thin film cathode post-annealed at 400 ℃

Microcell Center, Nuricell Inc., #503, Sinnae Technotown, 485 Sangbong-dong, Joongrang-gu, Seoul 131-863, Korea 1College of General Education, Kookmin University, Seoul 136-702, Korea 2Advanced Technology Research Center, Agency for Defense Development, Yuseong P.O. Box 35, Daejeon 305-600, Korea
scnam@nuricell.com
Korean Journal of Chemical Engineering, September 2006, 23(5), 832-837(6), 10.1007/BF02705936
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Abstract

LiCoO2 thin film cathodes were prepared by RF magnetron sputtering and post-annealing. The surface morphological change of the LiCoO2 thin film was in-situ measured by hot stage SEM with increasing temperature. The effects of sputtering gas pressure and post-annealing at low temperature (400 ℃) were investigated by XRD, AFM, ICP-AES and RBS. The electrochemical characteristics of LiCoO2 thin films were changed with variation of sputtering gas pressure. A difference of micro-structural evolution after post-annealing was observed, which related to the thin film properties. The electrochemical analysis revealed that the optimal sputtering gas pressure with the low temperature annealing step increases cell capacity and rate capability.

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