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Received October 10, 2008
Accepted March 29, 2009
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Characterization of FePt film electrodeposited with a ferric electrolyte
Advanced Materials and Process Research Center for IT, Department of Chemical Engineering, Sungkyunkwan University, Suwon 440-746, Korea 1LCD Technology Center, Samsung Electronics Co., Yong-in 446-711, Korea
chchung@skku.edu
Korean Journal of Chemical Engineering, November 2009, 26(6), 1766-1769(4), 10.1007/s11814-009-0244-1
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Abstract
The electrodeposition of FePt alloy film in a novel ferric electrolyte that could be an alternative electrolyte to the usual non-stable baths was investigated. The influence of the applied current density and electrolyte temperature on the composition of the alloy was studied. It was found that co-deposition of oxygen can be reduced by deposition at higher temperature of 65 ℃ than room temperature. The as-deposited film had a face-centered cubic (γ-Fe,Pt) structure, and after an additional annealing process, the structure was changed to a face-centered tetragonal structure. The as-deposited FePt film also shows good resistance to corrosion and its coercivity was about 0.1T, which makes it suitable for use in applications compatible with silicon technology.
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