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In relation to this article, we declare that there is no conflict of interest.
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Received March 15, 2010
Accepted April 13, 2010
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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The electroless plating of Cu-Ni-P alloy onto cotton fabrics

University of Guilan, P.O. Box 3756, Rasht, Iran 1Guilan Science and Ttechnology Park (GSTP), Rasht, Iran
Haghi@Guilan.ac.ir
Korean Journal of Chemical Engineering, July 2010, 27(4), 1145-1149(5), 10.1007/s11814-010-0221-8
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Abstract

The objective of this study is to apply the electroless plating of Cu-Ni-P alloy on cotton fabrics to the preparation of conductive fabrics. The alloy composed of infinit small amount of nickel and phosphorus particle originated from sodium hypophosphite and nickel sulphate respectively as reducing agent and hypophosphite oxidation accelerator. Electroless plating of Cu-Ni-P alloy on cotton fabrics and effect of plating on the physical and mechanical properties of alloy coated fabrics as well as electromagnetic interference (EMI) shielding effectiveness were reported in_x000D_ detail. In this research highly washing and abrasion durable conductive fabrics obtained with supreme shielding effectiveness.

References

Guo RH, Jiang SQ, Yuen CWM, Ng MCF, J. Mater. Sci.: Mater Electron, DOI 10.1007/s10854-008-9594-4 (2008)
Lin YM, Yen SC, Appl. Surf. Sci., 178(1-4), 116 (2001)
Xueping G, Yating W, Lei L, Bin S, Wenbin H, J. Alloys Compounds., 455, 308 (2008)
Li J, Hayden H, Kohl PA, Electrochim. Acta, 49(11), 1789 (2004)
Larhzil H, Cisse M, Touir R, Touhami ME, Cherkaoui M, Electrochim. Acta, 53(2), 622 (2007)
Gaudiello JG, Ballard GL, IBM J. RES. DEVELOP., 37(2) (1993)
Xueping G, Yating W, Lei L, Bin S, Wenbin H, Surface & Coatings Technology., 201, 7018 (2007)
Han EG, Kim EA , Oh KW, Synth. Met., 123, 469 (2001)
Jiang SQ, Guo RH, Fibers and Polymers., 9, 755 (2008)
Djokic SS, Fundamental Aspects of Electrometallurgy: Chapter 10, Metal Deposition without an External Current, Eds., Popov KI, Djokic SS Grgur BB, pp. 249-270, Kluwer Academic Publishers New York (2002)
Mallory O, Hajdu BJ, Eds., Electroless Plating: Fundamentals and Applications, Noyes Publication, New York (1990)
Agarwala RC, Agarwala V, Sadhana., 28, 475 (2003)
Paunovic M, Plating., 51, 1161 (1968)
Chang HF, Lin WH, Korean J. Chem. Eng., 15(5), 559 (1998)

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