Articles & Issues
- Language
- English
- Conflict of Interest
- In relation to this article, we declare that there is no conflict of interest.
- Publication history
-
Received August 24, 2009
Accepted February 21, 2010
-
This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits
unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.
All issues
Controlling the oxidation of organic brightener during electroplating using an ion-exchange membrane
Department of Chemical Engineering, Kongju National University, 275 Budae-dong, Seobuk-gu, Cheonan, Chungnam 331-717, Korea
jhchoi@kongju.ac.kr
Korean Journal of Chemical Engineering, July 2010, 27(4), 1213-1219(7), 10.1007/s11814-010-0209-4
Download PDF
Abstract
The effect of an ion-exchange membrane combined with a dimensionally stable anode on the oxidation rate of organic brightener and electroplating performance was investigated. The oxidation rate of the brightener was measured by analyzing the total organic carbon content in the plating solution. The oxidation rate increased rapidly as the current density increased when there was no ion-exchange membrane. However, when an ion-exchange membrane was present, the oxidation rate of the brightener was significantly reduced by Neosepta CMX and CMS cationexchange membranes. The CMS monovalent selective cation-exchange membrane in particular was the most effective in reducing organic brightener oxidation, regardless of the current density. Through-hole printed circuit board electroplating was more precise with an ion-exchange membrane than with no membrane. These results confirmed that the electroplating performance was improved by the presence of an ion-exchange membrane on the anode, effectively inhibiting the oxidation of organic brightener.
References
Yeo WD, Yoo JY, Hong SK, Printed Circuit Board (PCB), KISTI, Seoul
Miura S, Honma H, Surf. Coat. Technol., 169, 91 (2003)
Lefebvre MJ, Allardyce G, Seita M, Tsuchida H, Kusaka M, Hayashi S, Circuit World., 29, 9 (2003)
Dow WP, Yen MY, Liao SZ, Chiu YD, Huang HC, Electrochim. Acta, 53(28), 8228 (2008)
Li J, Lu H, Guo J, Xu Z, Zhou Y, Environ. Sci. Technol., 41, 1995 (2007)
Huang K, Guo J, Xu ZM, J. Hazard. Mater., 164(2-3), 399 (2009)
Kobayashi T, Kawasaki J, Mihara K, Honma H, Electrochim. Acta, 47(1-2), 85 (2001)
Pohjornta A, Tenno R, J. Electrochem. Soc., 154, D152 (2007)
Coombs CF, Printed Circuits Handbook., McGraw-Hill, New York (2008)
Stangl M, Dittel V, Acker J, Hoffmann V, Gruner W, Strehle S, Wetzig K, Appl. Surf. Sci., 252(1), 158 (2005)
Abrams F, Printed Circuit Fabrication., 23, 56 (2000)
Kabdasli I, Arslan T, Olmez-Hanci T, Arslan-Alaton I, Tunay O, J. Hazard. Mater., 165(1-3), 838 (2009)
Adhoum N, Monser L, Bellakhal N, Belgaied JE, J. Hazard. Mater., 112(3), 207 (2004)
Golder AK, Samanta AN, Ray S, J. Hazard. Mater., 141(3), 653 (2007)
Golder AK, Dhaneesh V, Samanta AN, Ray S, Chem. Eng.Technol., 1, 143 (2008)
Golder AK, Samanta AN, Ray S, Sep. Purif. Technol., 53(1), 33 (2007)
Lai CL, Lin KS, J. Hazard. Mater., 136(2), 183 (2006)
Xiu FR, Zhang FS, J. Hazard. Mater., 165(1-3), 1002 (2009)
Harris DC, Exploring chemical analysis (2nd Ed.)., Freeman, New York (2001)
Bard AJ, Faulkner LR, Electrochemical methods., 2nd Ed.,Wiley, New York (2001)
Strathmann H, Ion-exchange membrane separation processes., Elsevier, Amsterdam (2004)
Gohil GS, Binsu VV, Shahi VK, J. Membr. Sci., 280(1-2), 210 (2006)
Tuan LX, Mertens D, Buess-Herman C, Desalination, 240(1-3), 351 (2009)
Zhang Y, Van der Bruggen B, Pinoy L, Meesschaert B, J. Membr. Sci., 332(1-2), 104 (2009)
Hamid ZA, Aal AA, Surf. Coat. Technol., 203, 1360 (2009)
Hong B, Jiang C, Wang X, Surf. Coat. Technol., 201, 7449 (2007)
Choi JH, Moon SH, J. Colloid Interface Sci., 265(1), 93 (2003)
Choi JH, Kim SH, Moon SH, J. Colloid Interface Sci., 241(1), 120 (2001)
Le XT, J. Colloid Interface Sci., 325(1), 215 (2008)
Miura S, Honma H, Surf. Coat. Technol., 169, 91 (2003)
Lefebvre MJ, Allardyce G, Seita M, Tsuchida H, Kusaka M, Hayashi S, Circuit World., 29, 9 (2003)
Dow WP, Yen MY, Liao SZ, Chiu YD, Huang HC, Electrochim. Acta, 53(28), 8228 (2008)
Li J, Lu H, Guo J, Xu Z, Zhou Y, Environ. Sci. Technol., 41, 1995 (2007)
Huang K, Guo J, Xu ZM, J. Hazard. Mater., 164(2-3), 399 (2009)
Kobayashi T, Kawasaki J, Mihara K, Honma H, Electrochim. Acta, 47(1-2), 85 (2001)
Pohjornta A, Tenno R, J. Electrochem. Soc., 154, D152 (2007)
Coombs CF, Printed Circuits Handbook., McGraw-Hill, New York (2008)
Stangl M, Dittel V, Acker J, Hoffmann V, Gruner W, Strehle S, Wetzig K, Appl. Surf. Sci., 252(1), 158 (2005)
Abrams F, Printed Circuit Fabrication., 23, 56 (2000)
Kabdasli I, Arslan T, Olmez-Hanci T, Arslan-Alaton I, Tunay O, J. Hazard. Mater., 165(1-3), 838 (2009)
Adhoum N, Monser L, Bellakhal N, Belgaied JE, J. Hazard. Mater., 112(3), 207 (2004)
Golder AK, Samanta AN, Ray S, J. Hazard. Mater., 141(3), 653 (2007)
Golder AK, Dhaneesh V, Samanta AN, Ray S, Chem. Eng.Technol., 1, 143 (2008)
Golder AK, Samanta AN, Ray S, Sep. Purif. Technol., 53(1), 33 (2007)
Lai CL, Lin KS, J. Hazard. Mater., 136(2), 183 (2006)
Xiu FR, Zhang FS, J. Hazard. Mater., 165(1-3), 1002 (2009)
Harris DC, Exploring chemical analysis (2nd Ed.)., Freeman, New York (2001)
Bard AJ, Faulkner LR, Electrochemical methods., 2nd Ed.,Wiley, New York (2001)
Strathmann H, Ion-exchange membrane separation processes., Elsevier, Amsterdam (2004)
Gohil GS, Binsu VV, Shahi VK, J. Membr. Sci., 280(1-2), 210 (2006)
Tuan LX, Mertens D, Buess-Herman C, Desalination, 240(1-3), 351 (2009)
Zhang Y, Van der Bruggen B, Pinoy L, Meesschaert B, J. Membr. Sci., 332(1-2), 104 (2009)
Hamid ZA, Aal AA, Surf. Coat. Technol., 203, 1360 (2009)
Hong B, Jiang C, Wang X, Surf. Coat. Technol., 201, 7449 (2007)
Choi JH, Moon SH, J. Colloid Interface Sci., 265(1), 93 (2003)
Choi JH, Kim SH, Moon SH, J. Colloid Interface Sci., 241(1), 120 (2001)
Le XT, J. Colloid Interface Sci., 325(1), 215 (2008)
