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Received December 3, 2010
Accepted April 11, 2011
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This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits
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The utilization of microencapsulated phase change material wallboards for energy saving
Climate Change Technology Research Division, Korea Institute of Energy Research, Daejeon 305-343, Korea
jaegoo@kier.re.kr
Korean Journal of Chemical Engineering, November 2011, 28(11), 2206-2210(5), 10.1007/s11814-011-0099-0
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Abstract
Wallboards with micro encapsulated phase changing material (micro PCM) were used to investigate the performance and the energy saving characteristics as building materials in winter and summer climate conditions. The test house consisted of a boiler with under floor heating system, an air conditioner, micro PCM wallboard room and conventional wallboard room. The outer temperature of the rooms could be artificially controlled at the temperature range of .12 to 35 ℃. Micro PCM content in wallboards was 0-4 kg/m2. The melting temperature and latent heat of_x000D_
Micro PCM are 23 ℃ and 211 J/g. Also, micro PCM shows stable mechanical strength under 500 psi. As micro PCM content increased, the temperature fluctuations decreased. In case of micro PCM wallboard, temperature profiles in the room show stable and comfortable ranges. The optimum amount of micro PCM in wallboard to maximize energy saving efficiency was around 3 kg/m2.
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References
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