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In relation to this article, we declare that there is no conflict of interest.
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Received March 29, 2011
Accepted May 19, 2011
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Epitaxial gallium nitride thin films grown on silicon substrates utilizing gallium nitride seed-layer formed by liquid source precursor

School of Chemical Engineering, Yeungnam University, Gyeongsan 712-749, Korea
Korean Journal of Chemical Engineering, January 2012, 29(1), 130-133(4), 10.1007/s11814-011-0141-2
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Abstract

Gallium nitride (GaN) epitaxial thin films were deposited on Si substrates by a modified hydride vapor phase epitaxy (MHVPE) technique utilizing the GaN seed-layer formed from liquid source precursor. Tris N,N-dimethyldithiocarbamato gallium(III) (Ga(mDTC)3) powder was dissolved in chloroform (CHCl3) to prepare the liquid source precursor for seed-layer formation. The developed method was found to be suitable for the epitaxial growth of GaN on Si in spite of the large mismatch in lattice constants and thermal expansion coefficients, resulting in device-quality_x000D_ epitaxial films with fairly smooth surface morphology. The epitaxial GaN films obtained in this study had a hexagonal structure with (0002) preferred orientation with the FWHM value of 428.6 arcsec of the (0002) GaN XRD peak. Photoluminescence spectra of GaN films exhibited a strong and sharp peak at 3.41 eV with the FWHM value of 107meV.

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