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In relation to this article, we declare that there is no conflict of interest.
Publication history
Received October 22, 2016
Accepted November 12, 2016
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Iron oxide grown by low-temperature atomic layer deposition

School of Chemical Engineering, Chonnam National University, 300 Youngbong-dong, Gwangju 61186, Korea 1Center for Vacuum, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon 34113, Korea
kdhh@chonnam.ac.kr
Korean Journal of Chemical Engineering, December 2016, 33(12), 3516-3522(7), 10.1007/s11814-016-0319-8
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Abstract

Atomic layer deposition (ALD) is a promising technology for fabricating conformal thin films of atomlevel thickness with chemical composition control over a variety of structures. This paper demonstrates the ALD of iron oxide thin films using a novel iron precursor, namely, bis[bis(trimethylsilyl)amide]iron [Fe(btmsa)2] and hydrogen peroxide as an oxygen source. The growth characteristics of iron oxide were investigated by varying the deposition temperatures from 100 to 225 °C, such that the ALD growth mode was observed at 150 to 175 °C with an average growth rate of 0.035±0.005 nm/cycle. The films deposited in ALD mode exhibited highly linear film thicknesses with the number of cycles and excellent conformality over high-aspect-ratio trenches. In addition, the deposited films were extremely pure and revealed a hematite phase without any subsequent heat treatment, even if the films were deposited at low temperatures.

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