Articles & Issues
- Language
- English
- Conflict of Interest
- In relation to this article, we declare that there is no conflict of interest.
- Publication history
-
Received September 10, 2015
Accepted February 1, 2016
- This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.
All issues
Extremely flexible organic-inorganic moisture barriers
School of Chemical Engineering, Sungkyunkwan University, Suwon 16419, Korea
sungmcho@skku.edu
Korean Journal of Chemical Engineering, June 2016, 33(6), 1971-1976(6), 10.1007/s11814-016-0037-2
Download PDF
Abstract
Organic/inorganic multilayer structures were fabricated for extreme flexibility as well as enhanced moisturebarrier property. The organic and inorganic layers for the structures were formed by plasma polymerization and atomic layer deposition, respectively. The layers were grown alternately to form the organic/inorganic multilayer structures on a plastic substrate. To accomplish extreme flexibility of the barriers, ultra-thin aluminum oxide layers were grown by the atomic layer deposition and sandwiched by a flexible plasma-polymer layer. The moisture-barrier films were then confirmed to retain the initial barrier property even after 10,000 times of bending at a radius as small as 3mm when the barrier structure was located at a neutral plane.
References
Carcia PF, McLean RS, Reilly MH, Appl. Phys. Lett., 97, 221901 (2010)
Meyer J, Schmidt H, Kowalsky W, Riedl T, Kahn A, Appl. Phys. Lett., 96, 243308 (2010)
Riedl T, Winkler T, Schmidt H, Meyer J, Schneidenbach D, Johannes HH, Kowalsky W, Weimann T, Hinze P, IEEE Int. Reliab. Phys. Symp., Anaheim (USA), 327 (2010).
Groner MD, George SM, McLean RS, Carcia PF, Appl. Phys. Lett., 88, 051907 (2006)
Dameron AA, Davidson SD, Burton BB, Carcia PF, McLean RS, George SM, J. Phys. Chem. C, 112, 4573 (2008)
Carcia PF, McLean RS, Reilly MH, Groner MD, George SM, Appl. Phys. Lett., 89, 031915 (2006)
Jen SH, Bertrand JA, George SM, J. Appl. Phys., 109, 084305 (2011)
Goktas H, Ince FG, Iscan A, Yildiz I, Kurt M, Kaya I, Synth. Met., 159, 2001 (2009)
Giungato P, Ferrara MC, Musio F, d’Agostino R, Plasmas Polym., 1, 283 (1996)
Hozumi K, Kitamura K, Hashimoto H, Hamaoka T, Fujisawa H, Ishizawa T, J. Appl. Polym. Sci., 28, 1651 (1983)
Bhat NV, Upadhyay DJ, Plasmas Polym., 8, 99 (2003)
Jiang Z, Meng Y, Jiang ZJ, Shi Y, Surf. Rev. Lett., 16, 297 (2009)
Jobanputra MC, Durstock MF, Clarson SJ, J. Appl. Polym. Sci., 87, 523 (2002)
Choudhury AJ, Chutia J, Barve SA, Kakati H, Pal AR, Jagannath, Mithal N, Kishore R, Pandey M, Patil DS, Prog. Org. Coat., 70, 75 (2011)
Pedersen RH, Scurr DJ, Roach P, Alexander MR, Gadegaard N, Plasma Process. Polym., 9, 22 (2012)
Fang JL, Chen H, Yu YH, J. Appl. Polym. Sci., 80(9), 1434 (2001)
Li K, Gabriel O, Meichsner J, J. Phys. D-Appl. Phys., 37, 588 (2004)
Mandlik P, Gartside J, Han L, Cheng IC, Wagner S, Silvernail JA, Ma RQ, Hack M, Brown JJ, Appl. Phys. Lett., 92, 103309 (2008)
Seo SW, Chae H, Seo SJ, Chung HK, Cho SM, Appl. Phys. Lett., 102, 161908 (2013)
Seo SW, Jung E, Chae H, Cho SM, Org. Electron., 13, 2436 (2012)
Park SI, Ahn JH, Feng X, Wang SD, Huang YG, Rogers JA, Adv. Funct. Mater., 18(18), 2673 (2008)
Despax B, Raynaud P, Plasma Process. Polym., 4, 127 (2007)
Kaneto K, Yoshino K, Inuishi Y, Solid State Commun., 46, 389 (1983)
Yasuda H, Plasma polymerization, Academic Press, New York (1985).
Gok A, Oksuz L, J. Macromol. Sci.-Pure Appl. Chem., 44, 1095 (2007)
Wilson CA, Grubbs RK, George SM, Chem. Mater., 17, 5625 (2005)
Meyer J, Schmidt H, Kowalsky W, Riedl T, Kahn A, Appl. Phys. Lett., 96, 243308 (2010)
Riedl T, Winkler T, Schmidt H, Meyer J, Schneidenbach D, Johannes HH, Kowalsky W, Weimann T, Hinze P, IEEE Int. Reliab. Phys. Symp., Anaheim (USA), 327 (2010).
Groner MD, George SM, McLean RS, Carcia PF, Appl. Phys. Lett., 88, 051907 (2006)
Dameron AA, Davidson SD, Burton BB, Carcia PF, McLean RS, George SM, J. Phys. Chem. C, 112, 4573 (2008)
Carcia PF, McLean RS, Reilly MH, Groner MD, George SM, Appl. Phys. Lett., 89, 031915 (2006)
Jen SH, Bertrand JA, George SM, J. Appl. Phys., 109, 084305 (2011)
Goktas H, Ince FG, Iscan A, Yildiz I, Kurt M, Kaya I, Synth. Met., 159, 2001 (2009)
Giungato P, Ferrara MC, Musio F, d’Agostino R, Plasmas Polym., 1, 283 (1996)
Hozumi K, Kitamura K, Hashimoto H, Hamaoka T, Fujisawa H, Ishizawa T, J. Appl. Polym. Sci., 28, 1651 (1983)
Bhat NV, Upadhyay DJ, Plasmas Polym., 8, 99 (2003)
Jiang Z, Meng Y, Jiang ZJ, Shi Y, Surf. Rev. Lett., 16, 297 (2009)
Jobanputra MC, Durstock MF, Clarson SJ, J. Appl. Polym. Sci., 87, 523 (2002)
Choudhury AJ, Chutia J, Barve SA, Kakati H, Pal AR, Jagannath, Mithal N, Kishore R, Pandey M, Patil DS, Prog. Org. Coat., 70, 75 (2011)
Pedersen RH, Scurr DJ, Roach P, Alexander MR, Gadegaard N, Plasma Process. Polym., 9, 22 (2012)
Fang JL, Chen H, Yu YH, J. Appl. Polym. Sci., 80(9), 1434 (2001)
Li K, Gabriel O, Meichsner J, J. Phys. D-Appl. Phys., 37, 588 (2004)
Mandlik P, Gartside J, Han L, Cheng IC, Wagner S, Silvernail JA, Ma RQ, Hack M, Brown JJ, Appl. Phys. Lett., 92, 103309 (2008)
Seo SW, Chae H, Seo SJ, Chung HK, Cho SM, Appl. Phys. Lett., 102, 161908 (2013)
Seo SW, Jung E, Chae H, Cho SM, Org. Electron., 13, 2436 (2012)
Park SI, Ahn JH, Feng X, Wang SD, Huang YG, Rogers JA, Adv. Funct. Mater., 18(18), 2673 (2008)
Despax B, Raynaud P, Plasma Process. Polym., 4, 127 (2007)
Kaneto K, Yoshino K, Inuishi Y, Solid State Commun., 46, 389 (1983)
Yasuda H, Plasma polymerization, Academic Press, New York (1985).
Gok A, Oksuz L, J. Macromol. Sci.-Pure Appl. Chem., 44, 1095 (2007)
Wilson CA, Grubbs RK, George SM, Chem. Mater., 17, 5625 (2005)