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Received July 5, 2016
Accepted September 5, 2016
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Electroless Pd deposition on a planar porous stainless steel substrate using newly developed plating rig and agitating water bath

1Advanced Materials and Devices Laboratory, Korea Institute of Energy Research (KIER), 152 Gajeong-ro, Yuseong-gu, Daejeon 34129, Korea 2Department of Chemical and Biological Engineering, Korea University, 5-Ga, Anam-dong, Sungbuk-gu, Seoul 02841, Korea 3, Korea 4Department of Advanced Materials Engineering, Kyonggi University, Suwon, Gyeonggi-do 16227, Korea
Korean Journal of Chemical Engineering, January 2017, 34(1), 266-272(7), 10.1007/s11814-016-0256-6
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Abstract

A new plating bath was developed to prevent palladium plating in the pores of the porous stainless steel support when using plate-type porous substrate. The plating bath, composed of a holder, a rubber O-ring and a bottom, provides very simple assembly and is very effective in preventing palladium plating in the pores of porous stainless steel. The agitation of the plating solution increases plating rate significantly because the agitation improves the external mass transfer of Pd ion and reducing agent to the membrane surface facilitating ~99.7% plating yield of palladium ion. This new plating method carried out at a temperature range of 293 to 298 K provides a very simple and economic membrane manufacturing process. Using a newly developed plating rig, an 88.9-mm diameter membrane was fabricated, and gas permeation tests showed that the hydrogen permeation flux reached ~0.9mol s-1 m-2 at 873 K and a pressure difference of 300 kPa and selectivity (H2/N2) was ~1,850 at 873 K with a pressure difference of 100 kPa.

References

Ravanchi MT, Kaghazchi T, Kargari A, Desalination, 235(1-3), 199 (2009)
Iulianelli A, Basile A, Catal. Sci. Technol., 1, 366 (2011)
Mundschau MV, Xie X, Evenson CR, Sammells AF, Catal. Today, 118(1-2), 12 (2006)
Uemiya S, Sep. Purif. Methods, 28(1), 51 (1999)
Gallucci F, Fernandez E, Corengia P, Annaland MV, Chem. Eng. Sci., 92, 40 (2013)
Paglieri SN, Way JD, Sep. Purif. Methods, 31(1), 1 (2002)
Ryi SK, Xu N, Li AW, Lim CJ, Grace JR, Int. J. Hydrog. Energy, 35(6), 2328 (2010)
Li AW, Liang WQ, Hughes R, Catal. Today, 56(1-3), 45 (2000)
Ayturk ME, Ma YH, J. Membr. Sci., 330(1-2), 233 (2009)
Volpe M, Inguanta R, Piazza S, Sunseri C, Surf. Coat. Technol., 200, 5800 (2006)
Okinaka Y, Wolowodiuk C, Electroless Plating of Platinum Group Metals, in: Malloy GO, Hajdu JB, Electroless Plating:Fundamentals And Application, Reprint Ed., Noyes Publications/William Andrew Publishing, LLC, New York, 421 (1990).
Yeung KL, Aravind R, Szegner J, Varma A, Stud. Surf. Sci. Catal., 101, 1349 (1996)
Nair BKR, Choi J, Harold MP, J. Membr. Sci., 288(1-2), 67 (2007)
Yeung KL, Christiansen SC, Varma A, J. Membr. Sci., 159(1-2), 107 (1999)
Keuler JN, Lorenzen L, Miachon S, Sep. Sci. Technol., 37(2), 379 (2002)
Ilias S, Su N, Udoaka UI, King FG, Sep. Sci. Technol., 32(1-4), 487 (1997)
Govind R, Atneor D, Ind. Eng. Chem. Res., 30, 591 (1991)
Ryi SK, Lee SW, Oh DK, Seo BS, Park JW, Park JS, Lee DW, Kim SS, J. Membr. Sci., 467, 93 (2014)
Ryi SK, Park JS, Hwang KR, Kim DW, An HS, Korean J. Chem. Eng., 29(1), 59 (2012)
Ryi SK, Lee CB, Lee SW, Park JS, Energy, 51, 237 (2013)
Capaccio R, Wastewater Treatment For Electroless Plating, in:Malloy GO, Hajdu JB, Electroless Plating: Fundamentals And Application, Reprint Ed., Noyes Publications/William Andrew Publishing, LLC, New York, 519 (1990).
Ayturk ME, Ma YH, J. Membr. Sci., 330(1-2), 233 (2009)
Braun F, Tarditi AM, Cornaglia LM, J. Membr. Sci., 382(1-2), 252 (2011)
Bulasara VK, Uppaluri R, Purkait MK, Mater. Manuf. Process., 27, 201 (2012)
Bulasara VK, Uppaluri R, Purkait MK, Surf. Eng., 29, 489 (2013)
Mardilovich PP, She Y, Ma YH, Rei MH, AIChE J., 44(2), 310 (1998)
Ward TL, Dao T, J. Membr. Sci., 153(2), 211 (1999)
Ryi SK, Park JS, Kim SH, Kim DW, Cho KI, J. Membr. Sci., 318(1-2), 346 (2008)

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