Dendritic copper powders are highly desirable in many applications, including electromagnetic interference shielding and conductive pastes, because of low cost and high conductivity. We prepared dendritic copper powders using the galvanic displacement reaction between the Al and Cu-ions in aqueous solution. This method is very simple and spontaneous at room temperature. During the process, the morphology of the copper powders is strongly affected by several variables, such as the displacement reaction rate and the amount of hydrogen evolution due to the reduction of proton. The effect of the different composition of electrolytes to morphological changes of copper powders was investigated in this study. In addition, the effects of concentration of chlorine ion, pH, termination time, and additives were monitored, which resulted in different morphology. Considering different applications, such as sensors, catalysts, and conductive pastes, the controllability of the morphology of dendritic copper powders plays an important role in achieving high performance in desired applications.

Dendritic Copper Powders Galvanic Displacement Reaction Morphology Hydrogen Bubbles Copper Complex Reduction Potential

Kim CK, Lee GJ, Lee MK, Rhee CK, Powder Technol., 263, 1 (2014)
Cao XG, Zhang HY, Electron. Mater. Lett., 8(4), 467 (2012)
Zhang R, Lin W, Lawrence K, Wong CP, Int. J. Adhes. Adhes., 30, 403 (2010)
Hai HT, Takamura H, Koike J, J. Alloy. Compd., 564, 71 (2013)
Wu M, Lin B, Cao Y, Song J, Sun Y, Yang H, Zhang X, J. Mater. Sci.-Mater. El., 24, 4913 (2013)
Khatri I, Hoshino A, Watanabe F, Liu QM, Ishikawa R, Ueno K, Shirai H, Thin Solid Films, 558, 306 (2014)
Theuring M, Vehse M, von Maydell K, Agert C, Thin Solid Films, 558, 294 (2014)
Nishikawa H, Mikami S, Miyake K, Aoki A, Takemoto T, Mater. Trans., 51(10), 1785 (2010)
Chen Z, Zhang XD, Fang J, Liang JH, Liang XJ, Sun J, Zhang DK, Wang N, Zhao HX, Chen XL, Huang Q, Wei CC, Zhao Y, Appl. Energy, 135, 158 (2014)
Yang TL, Huang KY, Yang S, Hsieh HH, Kao CR, Sol. Energy Mater. Sol. Cells, 123, 139 (2014)
Tsai JT, Lin ST, J. Alloy. Compd., 548, 105 (2013)
Wen X, Xie YT, Wing M, Mak C, Cheung KY, Li XY, Renneberg R, Yang S, Langmuir, 22(10), 4836 (2006)
Fang J, You H, Kong P, Yi Y, Song X, Ding B, Cryst. Growth Des., 7(5), 864 (2007)
Lv S, Suo H, Zhao X, Wang C, Jing S, Zhou T, Xu Y, Zhao C, Solid State Commun., 149, 1755 (2009)
Lu S, Suo H, Wang H, Wang C, Wang J, Xu Y, Zhao C, Solid State Sci., 12, 1287 (2010)
Lu S, Suo H, Zhou T, Wang C, Jing S, Fu Q, Xu Y, Zhao C, Solid State Commun., 149, 227 (2009)
Kramer JR, Werstiuk NH, Ni B, J. Phys. Chem. A, 110(1), 273 (2006)
Zhuo YJ, Sun WD, Dong LH, Chu Y, Appl. Surf. Sci., 257(24), 10395 (2011)
Liu R, Sen A, Chem. Mater., 24, 48 (2012)
Chen X, Cui CH, Guo Z, Liu JH, Huang XHM, Yu SH, Small, 7(7), 858 (2011)
Liu R, Li S, Yu X, Zhang G, Ma Y, Yao J, Keita B, Nadjo L, Cryst. Growth Des., 11, 3424 (2011)
Huang TK, Cheng TH, Yen MY, Hsiao WH, Wang LS, Chen FR, Kai JJ, Lee CY, Chiu HT, Langmuir, 23(10), 5722 (2007)
Nadagouda MN, Varma RS, Crys. Growth Des., 7(12), 2582 (2007)
Jung DS, Lee HM, Kang YC, Park SB, J. Colloid Interface Sci., 364(2), 574 (2011)
Hai HT, Ahn JG, Kim DJ, Lee JR, Chung HS, Kim CO, Surf. Coat. Technol., 201, 3788 (2006)
Xu X, Luo X, Zhuang H, Li W, Zhang B, Mater. Lett., 57, 3987 (2003)
Barcaro G, Fortunelli A, Rossi G, Nita F, Ferrando R, J. Phys. Chem. B, 110(46), 23197 (2006)
Zhao J, Zhang D, Zhao J, J. Solid State Chem., 184, 2339 (2011)
Cao XG, Zhang HY, Appl. Surf. Sci., 264, 756 (2013)
Cao XG, Zhang HY, Appl. Surf. Sci., 264, 756 (2013)
Hai HT, Takamura H, Koike J, J. Alloy. Compd., 564, 71 (2013)
Wu M, Lin B, Cao Y, Song J, Sun Y, Yang H, Zhang X, J.Mater. Sci.-Mater. Electron., 24, 4913 (2013)
Kang Y, Chen F, J. Appl. Electrochem., 46, 667 (2013)
Chen KT, Ray DT, Peng YH, Hsu YC, Curr. Appl. Phys., 13(7), 1496 (2013)
Cao XG, Zhang HY, Powder Technol., 226, 53 (2012)
Zhao J, Zhang DM, Song XJ, Appl. Surf. Sci., 258(19), 7430 (2012)
Mancier V, Bertrand CR, Dille J, Michel J, Fricoteaux P, Ultrason. Sonochem., 17, 690 (2010)
Tsai CH, Chen SY, Song JM, Chen IG, Lee HY, Corrosion Sci., 74, 123 (2013)
Cherevko S, Chung CH, Talanta, 80, 1371 (2010)
Arai S, Kitamura T, ECS Electrochem. Lett., 3(5), D7 (2014)
Qiu R, Cha HG, Noh HB, Shim YB, Zhang XL, Qiao R, Zhang D, Kim YI, Pal U, Kang YS, J. Phys. Chem. C, 113, 15891 (2009)
Djokic SS, Djokic NS, J. Electrochem. Soc., 158(4), D204 (2011)
Wu SH, Chen DH, J. Colloid Interface Sci., 273(1), 165 (2004)
Yan C, Xue D, Cryst. Growth Des., 8(6), 1849 (2008)
Liu Y, Chu Y, Zhuo YJ, Dong LH, Li LL, Li MY, Adv. Funct. Mater., 17(6), 933 (2007)
Zhang X, Wang G, Liu X, Wu H, Fang B, Cryst. Growth Des., 4, 1430 (2008)
Zhang ZY, Hu CG, Feng B, Zheng CH, He XS, Wang X, J. Supercond. Nov. Magn., 23, 893 (2010)
Mahima S, Karthik C, Garg S, Mehta R, Teki R, Ravishankar N, Ramanath G, Cryst. Growth Des., 10, 3925 (2010)
Zeng Y, Li T, Fu M, Jiang S, Zhang G, J. Alloy. Compd., 585, 277 (2014)
Huang LM, Luo LM, Ding XY, Luo GN, Zan X, Cheng JG, Wu YC, Powder Technol., 258, 216 (2014)
Shin HC, Dong J, Liu ML, Adv. Mater., 15(19), 1610 (2003)
Zhuo K, Jeong MG, Chung CH, RSC Adv., 3, 12611 (2013)
Soni PL, Vandna Soni, Coordination Chemistry, Taylor & Francis Group, Boca Raton, FL (2013).
Schlesinger M, Paunovic M, Modern electroplating, New York, Wiley, 5th Ed. (2010).