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Received July 5, 2017
Accepted August 27, 2017
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This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits
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Enhancement of thermal stability and chemical reactivity of phenolic resin ameliorated by nanoSiO2
Institute of Chemical Industry of Forest Products, CAF, Nanjing 210042, China 1School of Packaging, Michigan State University, East Lansing, MI48824, U.S.A., USA
zhlh990907@sina.com
Korean Journal of Chemical Engineering, January 2018, 35(1), 298-302(5), 10.1007/s11814-017-0240-9
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Abstract
Phenolic resin has unsatisfactory thermal stability owing to the poor anti-oxidation property of methylene and phenol groups. To overcome this defect, a series of phenolic resin modified by nanoSiO2 based on the tetraethoxysilane (TEOS) was successfully prepared via sol-gel method using phenol as solvent. The effect of nanoSiO2 on the structures and properties of phenolic resin/foam was investigated. TGA and DTG indicated that the initial decomposition temperature of PR-0.5 (TEOS accounted for 0.5% of phenolic resin) was 41.8 °C higher than the neat PR-0. DSC revealed that the peak temperature presented a parabolic shape with the dosage of the TEOS, its maximal value resting on the PR-0.5. FT-IR and XRD demonstrated that chemical crosslink was reacted between PR and nanoSiO2 hydrolyzed by the TEOS, forming new chemical bands. Reactivity analysis illustrated that the free phenol content and the hydroxymethyl group content changed sharply in PF-0.5, implying it has highest reactivity.
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