Articles & Issues
- Language
- English
- Conflict of Interest
- In relation to this article, we declare that there is no conflict of interest.
- Publication history
-
Received June 2, 2021
Accepted August 1, 2021
- This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.
All issues
Modification of a low-soda easy-sintered α-Al2O3 powder for the application in semiconductor/display production equipment
School of Materials Science and Engineering, Yeungnam University, Gyeongsan 38541, Korea
Korean Journal of Chemical Engineering, December 2021, 38(12), 2541-2548(8), 10.1007/s11814-021-0915-0
Download PDF
Abstract
Semiconductor and display production equipment requires highly plasma-resistant components, where α-Al2O3 plays a vital role in shielding and insulating. In the present study, the physicochemical properties of a new domestic α-Al2O3 powder were compared with those of imported ones currently used in the Korean industry. The particle size distribution revealed finer particles in the domestic powder that were generated during dry milling than the imported powder resulting in a broad size distribution and high surface area. An effort was made to eliminate the fine particles by heat treatment because they increase the viscosity of a slurry for wet processing and induce a low green and sintered density of the final products. In addition to the effects of heat treatment on the powder characteristics, the dispersion behavior of an aqueous Al2O3 slip was examined systematically upon the addition of each polymeric processing additive for filter pressing.
References
Zhang K, He R, Ding G, Bai X, Fang D, Ceram. Int., 47, 2303 (2021)
Qu XY, Wang FC, Shi CS, Zhao NQ, Liu EZ, He CN, He F, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 709, 223 (2018)
Kim DM, Kim KB, Yoon SY, Oh YS, Kim HT, Lee SM, J. Ceram. Soc. Jpn., 117, 863 (2009)
Kim DM, Lee SM, Kim SW, Kim HT, Oh YS, J. Korean Ceram. Soc., 45, 405 (2008)
Kim K, Efremov A, Lee J, Kwon KH, Yeom GY, J. Vac. Sci. Technol. A, 33, 031601 (2015)
Tatsumi T, Matsui M, Okigawa M, Sekine M, J. Vac. Sci. Technol. B, 18(4), 1897 (2000)
Kim DM, Oh YS, Kim S, Kim HT, Lim DS, Lee SM, Thin Solid Films, 519(20), 6698 (2011)
Cao YC, Zhao L, Luo J, Wang K, Zhang BP, Yokota H, Ito Y, Li JF, Appl. Surf. Sci., 366, 304 (2016)
Min JH, Lee J, Ayman MT, Kim HN, Park YJ, Yoon DH, Ceram. Int., 46, 2895 (2019)
Chem Consulting Report, Status of Ceramic Raw Materials and Policy for Industrial Promotion (in Korean), CMRI (2019).
Zahir MH, Nagano T, Rahman MM, Alhooshanie K, Chowdhury S, Aziz AM, J. European Ceram. Soc., 37, 2637 (2017)
Wang S, Li X, Wang S, Li Y, Zhai Y, Mater. Lett., 62, 3552 (2008)
Guo H, Li W, J. European Ceram. Soc., 38, 679 (2018)
Bae SI, Baik S, J. Am. Ceram. Soc., 77, 2499 (1994)
Xu X, Zhou S, Wu J, Zhang Q, Zhang Y, Zhu G, Ceram. Int., 46, 1895 (2020)
Cho KS, Lee HK, Min JH, J. Korean Ceram. Soc., 55(4), 352 (2018)
Borrella A, Salvador MD, Rocha VG, Fernandez A, Molina T, Moreno R, Compos. B Eng., 47, 255 (2013)
Liu Z, Wang Y, Li Y, ACS Comb. Sci., 14, 205 (2012)
Krishnan R, Vijayan S, Wilson P, Kumar PA, Prabhakaran K, Powder Technol., 385, 227 (2021)
Lallemant L, Fantozzi G, Garnier V, Bonnefont G, J. European Ceram. Soc., 32, 2909 (2012)
Guo H, Ye F, Li W, Song X, Xie G, Ceram. Int., 41, 14645 (2015)
Salomao R, Ferreira VL, Oliveira IRD, Souza ADV, Correr WR, J. European Ceram. Soc., 36, 4225 (2016)
Tiller FM, Tsai CD, J. Am. Ceram. Soc., 69, 882 (1986)
Mistler RE, Twiname ER, Tape casting: Theory and practice, The American Ceramic Society, USA (2000).
Bahena JLR, Cabrera AR, Valdivieso AL, Urbina RH, Sep. Sci. Technol., 37(8), 1973 (2002)
Lee JH, Yonathan P, Yoon DH, Kim WJ, Park JY, J. Ceram. Proc. Res., 10, 301 (2009)
Goldburg WI, Am. J. Phys., 67, 1152 (1999)
Qu XY, Wang FC, Shi CS, Zhao NQ, Liu EZ, He CN, He F, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 709, 223 (2018)
Kim DM, Kim KB, Yoon SY, Oh YS, Kim HT, Lee SM, J. Ceram. Soc. Jpn., 117, 863 (2009)
Kim DM, Lee SM, Kim SW, Kim HT, Oh YS, J. Korean Ceram. Soc., 45, 405 (2008)
Kim K, Efremov A, Lee J, Kwon KH, Yeom GY, J. Vac. Sci. Technol. A, 33, 031601 (2015)
Tatsumi T, Matsui M, Okigawa M, Sekine M, J. Vac. Sci. Technol. B, 18(4), 1897 (2000)
Kim DM, Oh YS, Kim S, Kim HT, Lim DS, Lee SM, Thin Solid Films, 519(20), 6698 (2011)
Cao YC, Zhao L, Luo J, Wang K, Zhang BP, Yokota H, Ito Y, Li JF, Appl. Surf. Sci., 366, 304 (2016)
Min JH, Lee J, Ayman MT, Kim HN, Park YJ, Yoon DH, Ceram. Int., 46, 2895 (2019)
Chem Consulting Report, Status of Ceramic Raw Materials and Policy for Industrial Promotion (in Korean), CMRI (2019).
Zahir MH, Nagano T, Rahman MM, Alhooshanie K, Chowdhury S, Aziz AM, J. European Ceram. Soc., 37, 2637 (2017)
Wang S, Li X, Wang S, Li Y, Zhai Y, Mater. Lett., 62, 3552 (2008)
Guo H, Li W, J. European Ceram. Soc., 38, 679 (2018)
Bae SI, Baik S, J. Am. Ceram. Soc., 77, 2499 (1994)
Xu X, Zhou S, Wu J, Zhang Q, Zhang Y, Zhu G, Ceram. Int., 46, 1895 (2020)
Cho KS, Lee HK, Min JH, J. Korean Ceram. Soc., 55(4), 352 (2018)
Borrella A, Salvador MD, Rocha VG, Fernandez A, Molina T, Moreno R, Compos. B Eng., 47, 255 (2013)
Liu Z, Wang Y, Li Y, ACS Comb. Sci., 14, 205 (2012)
Krishnan R, Vijayan S, Wilson P, Kumar PA, Prabhakaran K, Powder Technol., 385, 227 (2021)
Lallemant L, Fantozzi G, Garnier V, Bonnefont G, J. European Ceram. Soc., 32, 2909 (2012)
Guo H, Ye F, Li W, Song X, Xie G, Ceram. Int., 41, 14645 (2015)
Salomao R, Ferreira VL, Oliveira IRD, Souza ADV, Correr WR, J. European Ceram. Soc., 36, 4225 (2016)
Tiller FM, Tsai CD, J. Am. Ceram. Soc., 69, 882 (1986)
Mistler RE, Twiname ER, Tape casting: Theory and practice, The American Ceramic Society, USA (2000).
Bahena JLR, Cabrera AR, Valdivieso AL, Urbina RH, Sep. Sci. Technol., 37(8), 1973 (2002)
Lee JH, Yonathan P, Yoon DH, Kim WJ, Park JY, J. Ceram. Proc. Res., 10, 301 (2009)
Goldburg WI, Am. J. Phys., 67, 1152 (1999)