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- In relation to this article, we declare that there is no conflict of interest.
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Received August 15, 2021
Accepted September 27, 2021
- This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.
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Moisture-resistant and highly adhesive acrylate-based sealing materials embedded with oxime-based photoinitiators for hermetic optical devices
Department of Chemical Engineering, Soongsil University, Seoul 06978, Korea
Korean Journal of Chemical Engineering, December 2021, 38(12), 2567-2573(7), 10.1007/s11814-021-0962-6
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Abstract
The hermetic sealing of optoelectronic devices has attracted much attention because it can endow the devices with long-term operation reliability and high mechanical resistance. Herein, we present a facile and efficacious strategy for fabrication of water-resistant and highly adhesive acrylate-based sealing materials for hermetic optical devices using oxime-based photoinitiators. Compared with conventional sealing materials containing ketone-based photoinitiator, those embedded with oxime-based photointiators afforded a strong UV absorption in the effective wavelength range, a high UV curing conversion of 99.5% at a low radiant energy of 1.0 J cm-2, a remarkable adhesion strength of 42.2 kgf cm-2, an improved water impermeability of 5.3 g m?2 day-1, and a reduced internal pollution length of 104.9 μm. These excellent properties of the fabricated sealing materials are attributed to the fragmentation mechanism of oxime-based photoinitiators which can generate numerous initiating radicals through multi-step decomposition reactions, resulting in the efficient initiation for photoreaction with acrylate resins. This study provides promising sealing materials based on the oxime-based photoinitiators for ultra-slim and flexible optoelectronic applications.
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Kayaman-Apohan N, Demirci R, Cakir M, Gungor A, Radiat. Phys. Chem., 73, 254 (2005)
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Goss B, Int. J. Adhes. Adhes., 22, 405 (2002)
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Guo Y, Ji Z, Zhang Y, Wang X, Zhou F, J. Mater. Chem. A, 5, 16307 (2017)
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Moon JH, Shul YG, Han HS, Hong SY, Choi YS, Kim HT, Int. J. Adhes. Adhes., 25, 301 (2005)
Dulay MT, Choi HN, Zare RN, J. Sep. Sci., 30, 2979 (2007)
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Mizusaki M, Enomoto S, Liq. Cryst., 43, 1431 (2016)
Nakanishi T, Takahashi T, Mada H, Saito S, Jpn. J. Appl. Phys., 41, 3752 (2002)
Park Y, Kim H, Park D, Sung I, Eur. Polym. J., 46, 1642 (2010)
Li T, Tsai J, Chang R, Ho L, Yang C, IEEE. Trans. Ind. Electron., 60, 3976 (2013)