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Received September 25, 2021
Accepted November 7, 2021
- This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Enhanced electrical conductivity and electromagnetic shielding efficiency of epoxy resin using graphene nanoplatelets
Department of Polymer Materials, Jilin Institute of Chemical Technology, Jilin City 132022, P. R. China 1Jilin Jiuhua Foreign Affairs School, No. 100 Huanxie Road, Chuanying District, Jilin City 132012, P. R. China 2Department of Chemistry, Inha University, Nam-gu, Incheon 22212, Korea
jinfanlong@163.com
Korean Journal of Chemical Engineering, July 2022, 39(7), 1968-1974(7), 10.1007/s11814-021-1007-x
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Abstract
Graphene nanoplatelets (GNPs) employed as conductive fillers were added to an epoxy matrix, diglycidylether of bisphenol-A (DGEBA), to enhance the electrical conductivity and electromagnetic shielding efficiency of DGEBA. In addition, we investigated the influence of GNP fraction on the thermal properties, flexural strength, impact strength, electrical conductivity, electromagnetic shielding efficiency, and morphology of DGEBA/GNP nanocomposites. The electrical properties indicated that the electrical conductivity of DGEBA/GNP nanocomposites consisting of higher than 7.5 wt% GNPs was significantly improved compared to that of pristine DGEBA. The electromagnetic shielding efficiency of the nanocomposite showed a maximum value of 3.87 dB at 10 wt% GNPs, which is 287% higher than that of pristine DGEBA. An analysis of the fracture surfaces of the nanocomposites showed a rough morphology with numerous micro-cracks. In addition, the GNPs in the DGEBA matrix were stacked and formed a continuous conductive path at high GNP contents.
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References
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Yao SS, Ma CL, Jin FL, Park SJ, Korean J. Chem. Eng., 37(11), 2075 (2020)
Li W, Ma J, Wu S, Zhang J, Cheng J, Polym. Test, 101, 107275 (2021)
Chen J, Chu N, Zhao M, Jin FL, Park SJ, J. Appl. Polym. Sci., 137(48), 49592 (2020)
Liu S, Chevali VS, Xu Z, Hui D, Wang H, Compos. Part B-Eng., 136, 197 (2018)
Bae YH, Yu MJ, Vu MC, Choi WK, Kim SR, Compos. Sci. Technol., 155, 144 (2018)
Vovchenko L, Lozitsky O, Matzui L, Oliynyk V, Zagorodnii V, Skoryk M, Mater. Chem. Phys., 240, 122234 (2020)
Wang J, Ma C, Chen G, Dai P, Compos. Struct., 234, 111649 (2020)
Boumedienne N, Maaroufi A, Physica B, 578, 411853 (2020)
Li Y, Liu J, Wang S, Zhang L, Shen B, Compos. Part B-Eng., 182, 107615 (2020)
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Arribas C, Prolongo MG, Sáanchez-Cabezudo M, Moriche R, Prolongo SG, Polym. Degrad. Stabil., 170, 109003 (2019)
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Meng Q, Kenelak V, Chand A, Kang H, Han S, Liu T, J. Appl. Polym. Sci., 137(34), 48991 (2020)
Wang S, Xue H, Guo S, Cao M, Cong F, Araby S, Meng Q, J. Appl. Polym. Sci., 138(14), 50163 (2020)
Meng Q, Araby S, Oh JA, Chand A, Zhang X, Kenelak V, Ma J, Liu T, Ma J, J. Appl. Polym. Sci., 138(20), 50452 (2021)
Liu H, Liang C, Chen J, Huang Y, Cheng F, Wen F, Xu B, Wang B, ACS Appl. Mater. Inter., 8, 33230 (2016)
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Jin FL, Hu RR, Park SJ, Korean J. Chem. Eng., 37(5), 905 (2020)
Chen J, Hu RR, Jin FL, Park SJ, J. Appl. Polym. Sci., 138(16), 50250 (2021)
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Wang H, Yao SS, Guan Z, Jin FL, Park SJ, Korean J. Chem. Eng., 38(11), 2332 (2021)
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