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- Conflict of Interest
- In relation to this article, we declare that there is no conflict of interest.
- Publication history
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Received December 28, 2022
Revised February 16, 2023
Accepted March 14, 2023
- Acknowledgements
- This research was supported by the National Research Foundation (Grant No. NRF-2022R1A2C1013016) and by the Ministry of SMEs and Startups operated by the Korea Technology and Information Promotion Agency for SMEs (Grant No. S3271298), and funded and conducted under the Competency Development Program for Industry Specialists of the Korean Ministry of Trade, Industry and Energy (MOTIE), operated by Korea Institute for Advancement of Technology (KIAT, Grant No. P0012453, Next-generation Display Expert Training
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Organic co-agents for maintaining mechanical properties of rubber elastomers at high processing temperatures
School of Chemical Engineering and Materials Science, Department of Intelligent Energy and Industry, Chung-Ang University, Seoul 06974, Republic of Korea
jpark@cau.ac.kr
Korean Journal of Chemical Engineering, October 2023, 40(10), 2565-2571(7), 10.1007/s11814-023-1451-x
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Abstract
Heat easily degrades a common organic co-agent with a ring structure based on C-N and C-C bonds that
is frequently used in conjunction with peroxide-based initiators to cross-link polymer main chains, leading to the shattering of cross-linking points and deterioration of the physical properties of rubbers. In our study, we used co-agents
based on phenyl rings that had better bond strengths to improve the heat resistance of co-agents in an effort to maintain the mechanical qualities of rubber at high temperatures. Our results show that the mechanical properties of crosslinked rubbers were considerably maintained after heat treatment at a high temperature. Through extensive investigation, it was discovered that utilizing co-agents with stronger bond strengths caused to reduce the disintegration of the
crosslinking sites, which was the basis for retaining mechanical qualities
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27. N. Rattanasom, S. Prasertsri and K. Suchiva, J. Appl. Polym. Sci.,113, 3985 (2009).
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