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In relation to this article, we declare that there is no conflict of interest.
Publication history
Received May 14, 2022
Accepted August 10, 2022
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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A top-down fabrication process for a-IGZO thin film transistor and patterned organic light-emitting diode

Korean Journal of Chemical Engineering, March 2023, 40(3), 667-674(8), 10.1007/s11814-022-1255-4
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Abstract

A top-down fabrication process that can simultaneously implement an amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistor (TFT) and an organic light-emitting diode (OLED) device has been studied. The proposed process utilizing self-aligned imprint lithography (SAIL) is simple because it does not require any repetitive alignment and coating steps in the photolithography process for the TFT fabrication. This study reports that a single a- IGZO TFT and OLED device can be fabricated in a top-down manner using the SAIL process. These two devices were fabricated using only imprint lithography and plasma etching processes without any photholithography process, and they were confirmed to operate normally. Although these two devices were studied separately in this report, simultaneous top-down fabrication of an active-matrix OLED pixel composed of a-IGZO TFT and OLED connected together is also possible in principle. The proposed SAIL process is a very easy way to fabricate active-matrix OLED displays, and it can be utilized as an efficient display fabrication process if the few issues mentioned in this study are solved.

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