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Issue
Total 1 articles [ 키워드: Through silicon via (TSV) ]
No. Article
1 Korean Chemical Engineering Research, 54 (6), pp.723-733 (2016)
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정
Through-Silicon-Via Filling Process Using Cu Electrodeposition
김회철, 김재정