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거품분리법에 의한 구리이온 제거에 있어서 수소이온 농도의 영향

Effect of Hydrogen Ion Concentration on the Cu(II) Removal by the Foam Separation Techniques

HWAHAK KONGHAK, April 1988, 26(2), 158-163(6), NONE
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Abstract

수용액중의 구리(II)이온 제거를 계면활성제 Sodium Lauryl Sulfate를 사용하여 여러 가지 거품분리기술(거품분별법, 침전부상법, 흡착콜로이드 부상법)을 이용하여 행하였다. 구리이온 제거의 최적 pH는 거품분별법은 pH 6.0 이내의 영역, 침전부상법은 약 pH 9.0, 흡착콜로이드 부상법은 Fe(OH)3 및 Al(OH)3를 이용하는 경우 각각 pH 7.0 및 pH 8.0 근처에서 나타났다. Fe(OH)3를 흡착콜로이드로 사용하는 경우 AI(III)를 첨가하므로써 구리이온 제거가 넓은 영역의 pH(6.5∼9.0)에서 효과적으로 이루어졌다. 구리(II)이온의 제거는 흡착콜로이드 부상법에서 공침현상 및 carrier flotation으로 인하여 침전부상법에서 보다 낮은 pH 영역에서 이루어졌고 계면활성제의 흡착은 정전기력에 의한 물리흡착으로 이루어지고 있다.
Experimental investigations on the removal of Cu(II) from aqueous solution were carried out through various foam separation techniques; foam fractionation, precipitate flotation, and adsorbing colloid flotation using sodium lauryl sulfate as collector.
The optimum pH for Cu(II) removal was found to be in the range of pH less than 6 for the foam fractionation, to be about 9 for the precipitate flotation, about 7 for the adsorbing colloid flotation with Fe(OH)3 and about 8 for the adsorbing colloid flotation with Al(OH)3.
The working ranges of pH (6.5-9.0) for an effective removal of Cu(II) could be extended by the addition of Al(III) on adsorbing colloid flotation with Fe(OH)3. The effective removal of copper(II) could be achieved by adsorbing colloid flotation due to coprecipitation and carrier flotation at lower pH than by precipitate flotation.

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