몬트리올의정서에 의하여 오존층 파괴물질로 규정된 전자산업의 필수불가결한 세정제인 CFC 113 (1,1,2-trich-loro 1,2,2-trifluoroethane)의 사용이 앞으로 규제가 됨에 따라서 대체세정제의 개발이 활발히 진행되고 있다. 세정제로서 갖추어야할 가장 중요한 성질인 오염물질을 용해시키는 용해도를 Scatchard-Hildebrand relation에서의 용질의 활동도계수와 용해도 매개변수를 이용하여 이론적으로 구하였다. 전자산업에서 인쇄회로기판의 납땜전에 사용하는 로진계 flux의 주성분인 비극성 abietic acid를 오염물질로 정하고 세정제로서는 CFC 113을 비롯하여 water, acetonitrile, methanol, IPA, acetone, d-limonene, trichloroethylene, 1,1,1-trichloroethane, chloroform, methylene chloride, carbon tetrachloride, perchloroethylene을 사용하였다. 각 세정제에서의 몰용해도와 abietic acid의 요융열 8831cal/g-mol을 비선형 회귀방법으로 구하였다. 계산결과에 의하면 극성용매(water, acetonitrile, methanol)에 대한 몰용해도는 Scatchard-Hildebrand relation을 적용할 수 없으나 그밖의 비극성용매에 대한 몰용해도는 실험값과 비교한 결과 비교적 잘 일치하였다.

According to the Montreal Protocol, CFC 113(1,1,2-trichloro 1,2,2-trifluoroethane), one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic indus-try. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. As one of the min characteristics of solvents, the solubility is theoreticall;y calculated using the activity coefficient of solute from Scatchard-Hildebrand relation and the solubility parameters. Abietic acid is a major constituent of the rosin-based flux used for PCB sodering, and is esignated as a contaminant. The cleaning solvents used in this work include water, acetonitrile, methanol, IPA, acetone, d-limonene, trichloroethylene, 1,1,1-trichloroethane, chloroform, methylene chloride, carbon tetrachloride, perchloroethylene as well as CFC 113. By use of a non-linear regression technique, the mole fraction solubilities are calculated and the heat of fusion of abietic acid is found to be 8831cal/g-mol. The results show that for the polar solvents(water, acetonitrile and methanol), the mole fraction solubility can not be calculated using the Scatchard-Hildebrand relation, but for the other nonpolar solvents, the agreements between the calculated and the experimental solubilities are relatively good.

"CFC 대체기술개발을 위한 사전조사연구," 한국과학기술연구원 보고서 UCQ24-4344-6, 1991년 11월 (1991)
UNEP Report: "Solvents, Coatings, and Adhesives Technical Options Report," S.O. Anderson, Chairman (1991)
Report of EPA and ICOLP Technical Committee: "Conservationa nd Recycling Practices for CFC 113 and Methyl Chloroform," (1991)
Report and EPA and ICOLP Technical Committee: "Aqueous and Semi-Aqueous Alternatives for CFC 113 and Methyl Chloroform Cleaning of Printed Circuit Board Assemblies," (1991)
Report of EPA and ICOLP Technical Committee: "Alternatives for CFC 113 and Methyl Chloroform in Metal Cleaning," (1991)
노경호, 전자진흥(전자공업진흥회), 10월호, 31, 11월호, 23 (1992)
노경호, 전자부품, 10월호, 70 (1992)
노경호, 최대기, 이윤용, 화학공업과 기술지, 10(5), 328 (1992)
노경호, 이윤용, 분석과학, 5, 166A (1992)
Morgans WH, "Outlines of Paint Technology," Chares Griffin and Company, Ltd. (1969)
Prausnitz JM, "Molecular Thermodynamics of Fluid-Phase Equilibria," Prentice-Hall (1969)
Reid RC, Prausnitz JM, Sherwood TK, "The Properties of Gases and Liquids," 3rd ed., McGraw-Hill (1977)
Barton AFM, "CRC Handbook of Solubility Parameters and Other Cohesion Parameters," 2nd ed., CRC Press, Inc. (1985)
Flick EW, "Industrial Solvents Handbook," 4th ed., Noyes Data Corp. (1991)
IPC Technical Report, "Post Solder Solvent Cleaning Handbook," IPC (1987)
Covington AK, Dickinson T, "Physical Chemistry of Organic Solvent Systems," Plenum Press (1973)