ABS-PC 블렌드 엔지니어링 플라스틱상의 도금에 있어 최적 전처리 공정에 관하여 연구하였다. ABS-PC 블렌드 수지의 etching 공정전에 수지 표면을 팽윤, 부드럽게 하기 위하여 유기혼합물 용액에 침적시키는 preetching 공정을 도입하였다. 또한 촉매의 습윤성과 흡착력을 증가시키기 위하여 activating공정전에 sensitizing 공정을 도입하였으며, sensitizing 처리를 하지 않을 경우 접착력이 매우 약하게 나타났다. SEM과 표면조도 측정으로부터 preetching 공정이 수지표면을 매우 거칠고 접착력을 우수하게 만든다는 결과를 얻었으며 도금물질의 표면상태와 접착력은 ABS- PC 블렌드 수지의 성형조건에 크게 의존한다는 것을 확인하였다. ESCA 분석으로 전처리 후 수지표면의 잔류금 속의 종류와 양을 측정한 결과 잔류 Cr은 Sn과 Pd의 흡착에 크게 영향을 미치지 않으나 수지 표면과 Pd 사이의 흡착작용을 방해하여 접착력을 감소시키는 것으로 나타났다.

This paper aims to study and analyze the subject of optimal pretreatment processes for metal plating on engineering plastics, especially on ABS-PC blend resin. For ABS-PC blend resin, preetching process is employed to swell and soften the surface of plastics by immersing in the organic solvent mixtures, just before etching process. Senditizing process is also employed to increased wettability and adsorption of catalyst, just before activating process. If sensitizing treatment process is not carried out, adhesion strength is very poor. In the result of SEM and surface roughness measurement preetching treatment enable the surface condition to be very poor. In the result of SEM and surface roughness measurement preetching treatment enable the surface condition to be very rough and adhesion strength to be good. It shows that the relation between surface condition of plated article and adhesion strength depends markedly upon molding condition of ABS-PC blend resin. It, by means of ESCA, aims to what kinds of and how much quantity of the metal elements remain on the resin surface after pretreatment processes. Cr residue does not affect adsorption of Sn and Pd remarkably but adhesion is reduced, owing to obstruction between resin surface and Pd.

ABS-PC Blend Resin Metal Plating

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