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구리계 탈황제를 이용한 중저온 탈황반응 연구

Low-Temperature Desulfurizing Reaction with Cu-Containing Sorbents

HWAHAK KONGHAK, October 1999, 37(5), 795-799(5), NONE
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Abstract

CuO를 활성물질로 하는 탈황제를 제조하여 중저온(350-550oC)에서 황화/재생반응을 실행하고 반응특성을 연구하였다. 첨가제로 MoO3와 MnO2를 선택하였으며, 지지체물질로 SiO2를 선택하여 탈황제를 제조하였다. 중저온에서의 재생반응시에 황산화물이 형성되며 생성된 황산화물은 650oC이상에서 분해되었다. 소성온도가 높으면 금속산화물의 응결로 인해 황화반응속도가 느려졌다. MoO3에 의한 활성촉진경향은 확인되지 않았다. SiO2의 함량이 25%이하일 때 탈황제의 sulfur loading은 10%이상을 유지할 수 있었으며, SiO2가 첨가되지 않은 경우에는 황화가스의 물질전달에 장애가 생가는 것을 확인할 수 있었다.
The sorbents containing CuO as an active material were prepared and their effectiveness in desulfurization was investigated at low temperatures(350-550℃). MoO3 and MnO2 were chosen as additives and SiO2 was chosen as support material. In the low temperature regeneration reaction, sulfate was formed, which could not be decomposed until regeneration temperature reached 650℃. Sulfidation reaction rate decreased as calcination temperature increased. Promoting effect of MoO3 was not observed throughout the sulfidation/regeneration reaction. When SiO2 content was below 25% of sorbents cimposition, silfur loading of above 25% could be obtained. Mass transfer inhibition by sulfiding gas was observed for the sorbents containing no SiO2.

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