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접착 증진제가 첨가된 배합고무와 구리박막코드의 접착성질

Adhesion between Copper Film-Plated Steel Cord and Rubber Compound Containing Adhesion Promoter

조평래 전경수 류승균 서곤

Cho PL Jeon GS Ryu SK Seo G

HWAHAK KONGHAK, December 1999, 37(6), 834-838(5), NONE

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Abstract

코발트 염고 수지류 접착증진제 첨가량이 다른 배합고무와구리 도금두께가 다른 세 종류 구리박막코드를 제조하여 이들의 접착성질을 조사하였다. 황동피복코드와 마찬가지로 배합고무에 코발트 염과 수지류 접착증진제를 첨가하면 구리박막코드와 배합고무의 접착성질이 크게 향상되었다. 코발트 염과 접착증진제가 첨가된 배합고무와 구리 도금두께가 32nm로 얇은 구리박막코드의 접착성질이 초기와 노화 후 모두 황동피복코드와 비슷하거나 더 좋아서, 구리박막은 황동 대신 배합고무와 접착을 위한 스틸코드의 피복물질로 사용 될 수 있었다.

The adhesion properties between three copper film-plated steel cords (abbreviated hereafter as copper-plated cord) with different thicknesses of copper film and the rubber compounds containing different loadings of cobalt salt and resineous bonding promoter to rubber as well as that of brass-plated cord. The adhesion property between the copper-plated cord with thin copper film of 32nm and the rubber compound containing cobalt salt and resineous bonging promoter was similar to or higher than that of the brass-plated cord both before and after aging treatments, enabling the replacement of brass with thin copper film as a plating material for steel cord for adhesion with rubbber compound.

Keywords

Adhesion Copper-plated Cord Rubber Compound Cobalt Salt Resineous Bonging Promoter

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