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- In relation to this article, we declare that there is no conflict of interest.
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Received January 23, 2008
Accepted February 10, 2008
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유기 솔더 보존제의 코팅 및 플럭싱에 대한 메탄올/이소프로필알콜 비율의 영향
Effect of MeOH/IPA Ratio on Coating and Fluxing of Organic Solderability Preservatives
충남대학교 바이오응용화학부, 305-764 대전시 유성구 궁동 220 1호남석유화학, 305-726 대전시 유성구 장동 24-1 2생산기술연구원, 406-840 인천시 연수구 송도동 7-47
School of Applied Chemistry and Biological Engineering, Chungnam National University, 220 Gung-dong, Yuseong-gu, Daejeon 305-764, Korea 1Daedeok Research Institute, Honam Petrochemical Co., 24-1 Jang-dong, Yuseong-gu, Daejeon 305-726, Korea 2Nano Material Team, Advanced Material Center, Korea Institute of Industrial Technology, 7-47 Songdo-dong, Yeonsu-gu, Incheon 406-840, Korea
hchoi@cnu.ac.kr
Korean Chemical Engineering Research, April 2008, 46(2), 402-407(6), NONE Epub 29 May 2008
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Abstract
최근 모바일 전자 제품의 많은 사용으로 인하여 전자 기판의 기계적 충격에 대한 기준이 강화되고 있다. 따라서, 전자 기판의 패키징 공정에서 칩과 기판 간의 솔더 볼의 접합방법은 제품의 안정성과 신뢰성 확보를 위하여 기존의 금속간 화합물을 사용하는 방식에서 유기 솔더 보존제를 사용하는 방법으로 전환되고 있다. 그러나 기존의 유기 솔더 보존제들은 공정상에서의 열안정성 등의 여러 가지 단점이 발견되어 이를 보완하기 위한 새로운 유기 솔더 보존제의 개발이 요구되고 있다. 이전 연구에서 새로 개발된 유기 솔더 보존제를 기존 패키징 공정에 적용(플럭싱 공정에 적용)할때, 사용되는 플럭스의 성분비(메탄올/이소프로필알콜)에 따른 플럭싱의 차이를 파악하고, 이를 통하여 새로운 유기 솔더 보존제에 적합한 플럭스를 포뮬레이션 하는 것을 목적으로 하고 있다. 연구 결과, 새로운 유기 솔더 보존제의 플럭싱에는 메탄올의 함량비가 높아질수록 플럭싱이 더 우수해지는 경향을 나타내었다.
Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.
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