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Language: korean

Conflict of Interest: In relation to this article, we declare that there is no conflict of interest.

Publication history: Received August 10, 2011
Accepted October 5, 2011

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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염화제이철 수용액에 의한 스테인레스 강판의 식각에 관한 연구

Wet Etching of Stainless Steel Foil by Aqueous Ferric Chloride Solution

이형민 박무룡¹ 박광호¹ 박진호^†

Hyung Min Lee Mooryong Park¹ Gwang Ho Park¹ Chinho Park^†

영남대학교 화학공학부, 712-749 경북 경산시 대동 214-1 ¹(주) LG이노텍 생산기술팀, 730-713 경북 구미시 구포동 624

School of Chemical Engineering, Yeungnam University, 214-1 Dae-dong, Gyeongsan-si, Gyeongbuk 712-749, Korea ¹LG Innotek, Co., Ltd., 624 Gupo-dong, Gumi-si, Gyeongbuk 730-713, Korea

Korean Chemical Engineering Research, April 2012, 50(2), 211-216(6), NONE Epub 30 March 2012

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Abstract

염화제이철 수용액에 의한 스테인레스 강판의 식각반응에 관한 연구를 수행하였다. 식각액 교반속도, 식각온도, Fe3+ 이온 농도, 식각액의 유리산도 및 비중 등 여러 공정변수가 식각속도에 미치는 영향에 대해 조사하였고, 그 결과, AK(aluminum-killed) 철, 크롬(chlomium) 강, 그리고 스테인레스 강(STS430J1L 합금)의 식각반응이 1차 반응식을 잘 따름을 알 수 있었다. 또한 식각액의 피로도(fatigue ratio)가 16％ 이하로 유지되면 식각액 내에 슬러지가 발생하지 않으며, 식각된 강판의 표면거칠기 또한 좋아짐을 알 수 있었다. 본 연구에서 조사한 범위 내에서는, 식각액의 보메(Baume)_x000D_ 가 증가하면 식각속도는 감소하나 유리산도가 식각속도에 미치는 영향은 미비함을 알 수 있었다. 한편 본 연구의 실험 결과는 공정모델링을 통해 유도된 식각속도식의 계산결과와 잘 일치함을 알 수 있었다.

Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, Fe3+ ion concentration, free HCl concentration, specific gravity, etc.) on the etch rate was first studied, and it was found that the etch rate of AK (aluminum-killed) steel, chromium metal and stainless steel (STS430J1L alloy) follows the pseudo-first order reaction equation. When the fatigue ratio of etchant was kept under 16%, sludge was not formed in the solution, and the etched_x000D_ surface showed smooth roughness. The etch rate decreases as Baume of etchant increases, but the effect of free HCl concentration on the etch rate turned out to be minimal. Experimental data were compared with the calculated results from modeled equation, showing very good agreement.

Keywords

Etching Aqueous Ferric Chlroride Solution Etch Rate Stainless Steel Fatigue Ratio

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