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Received December 13, 2012
Accepted January 28, 2013
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유연성 폴리이미드 기판 위의 금 나노망
Gold Nanonetworks on a Flexible Polyimide Substrate
단국대학교 화학공학과, 448-701 경기도 용인시 수지구 죽전로 152 1홍익대학교 재료공학부, 339-701 충남 연기군 조치원읍 세종로 2639 2고려대학교 화공생명공학과, 136-701 서울시 성북구 안암로 145
Department of Chemical Engineering, Dankook University, 152 Jukjeon-ro, Suji-gu, Yongin-si, Gyeonggi 448-701, Korea 1Department of Materials Science and Engineering, Hongik University, 2639 Sejong-ro, Jochiwon-eup, Yeongi-gun, Chungnam 339-701, Korea 2Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 136-701, Korea
jangmountain@dankook.ac.kr
Korean Chemical Engineering Research, April 2013, 51(2), 292-295(4), 10.9713/kcer.2013.51.2.292 Epub 21 May 2013
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Abstract
불규칙한 나노선의 모임인 금 나노망이 간단한 수용액 합성법을 통하여 합성되었다. 직경이 10~15 nm 크기의 금나노망은 APTMS (3-aminopropyltrimethoxysilane) 처리를 통하여 기판과의 접착력을 크게 향상시킬 수 있었다. 코팅횟수의 조절을 통하여 기판 위 금 나노망의 밀도 조절이 가능하였으며, 균일하게 코팅된 나노망은 물리적 및 전기적으로 서로 연결된 구조를 보였다. 유연성 PI(polyimide) 기판에 증착된 금 나노망은 구부리기 전, 후 및 구부렸다 편 상태에서 동일한 전기 전도성을 나타내었다.
By using a simple solution based method, gold nanonetworks which are randomly distributed gold nanowires arrays were synthesized. After APTMS (3-aminopropyltrimethoxysilane)treatment, adhesion of gold nanonetworks with 10-15 nm diameters to the substrate was greatly enhanced. Density of gold nanonetworks increased with number of coating, and uniformly coated nanonetworks were connected physically and electrically. Gold nanonetworks deposited on the flexible polyimide substrate shows constant electrical conductivity for physical bending of the substrate.
Keywords
References
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