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Received April 16, 2015
Accepted June 24, 2015
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A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication
School of Energy and Integrated Materials Engineering, Department of Energy and Chemical Engineering, Kumoh National Institute of Technology, 61, Daehak-ro, Gumi, Gyeongbuk, 39177, Korea 1School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University, 1, Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea
chosk@kumoh.ac.kr
Korean Chemical Engineering Research, February 2016, 54(1), 108-113(6), 10.9713/kcer.2016.54.1.108 Epub 12 February 2016
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Abstract
A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to Cu2+ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.
References
Andricacos PC, Uzoh C, Dukovic J, Horkans J, Deligianni H, IBM J. Res. Dev., 42, 567 (1998)
Kim YS, Shin J, Kim HI, Cho JH, Seo HK, Kim GS, Shin HS, Korean Chem. Eng. Res., 43(4), 495 (2005)
Kwon OJ, Cho SK, Kim JJ, Korean Chem. Eng. Res., 47(2), 141 (2009)
Kim MJ, Kim JJ, Korean Chem. Eng. Res., 52(1), 26 (2014)
Mehdizadeh S, Dukovic JO, Andricacos PC, Romankiw LT, J. Electrochem. Soc., 139, 78 (1992)
Mehdizadeh S, Dukovic J, Andricacos PC, Romankiw LT, Cheh HY, J. Electrochem. Soc., 140(12), 3497 (1993)
Kondo K, Fukui K, Uno K, Shinohara K, J. Electrochem. Soc., 143(6), 1880 (1996)
Kondo K, Fukui K, J. Electrochem. Soc., 145(3), 840 (1998)
Kondo K, Tanaka Z, Monden T, Electrochim. Acta, 44(21-22), 3691 (1999)
Hayashi K, Fukui K, Tanaka Z, Kondo K, J. Electrochem. Soc., 148(3), C145 (2001)
Subramanian VR, White RE, J. Electrochem. Soc., 149(10), C498 (2002)
Kim B, Ritzdorf T, J. Electrochem. Soc., 151(5), C342 (2004)
Luo JK, Chu DP, Flewitt AJ, Spearing SM, Fleck NA, Milne WI, J. Electrochem. Soc., 152(1), C36 (2005)
Jenq SN, Wan CC, Wang YY, J. Electroanal. Chem., 609(2), 68 (2007)
Denn MM, Process fluid mechanics, Prentice-Hall, 1990, p.112.
Dukovic JO, IBM J. Res. Dev., 37, 125 (1993)
Moffat TP, Bonevich JE, Huber WH, Stanishevsky A, Kelly DR, Stafford GR, Josell D, J. Electrochem. Soc., 147(12), 4524 (2000)
Moffat TP, Wheeler D, Edelstein MD, Josell D, IBM J. Res. Dev., 49, 19 (2005)
Newman JS, Electrochemical Systems, Prentice-Hall, Englewood Cliffs, New Jersey, 2nd ed., 1991, p. 331.
Kim YS, Shin J, Kim HI, Cho JH, Seo HK, Kim GS, Shin HS, Korean Chem. Eng. Res., 43(4), 495 (2005)
Kwon OJ, Cho SK, Kim JJ, Korean Chem. Eng. Res., 47(2), 141 (2009)
Kim MJ, Kim JJ, Korean Chem. Eng. Res., 52(1), 26 (2014)
Mehdizadeh S, Dukovic JO, Andricacos PC, Romankiw LT, J. Electrochem. Soc., 139, 78 (1992)
Mehdizadeh S, Dukovic J, Andricacos PC, Romankiw LT, Cheh HY, J. Electrochem. Soc., 140(12), 3497 (1993)
Kondo K, Fukui K, Uno K, Shinohara K, J. Electrochem. Soc., 143(6), 1880 (1996)
Kondo K, Fukui K, J. Electrochem. Soc., 145(3), 840 (1998)
Kondo K, Tanaka Z, Monden T, Electrochim. Acta, 44(21-22), 3691 (1999)
Hayashi K, Fukui K, Tanaka Z, Kondo K, J. Electrochem. Soc., 148(3), C145 (2001)
Subramanian VR, White RE, J. Electrochem. Soc., 149(10), C498 (2002)
Kim B, Ritzdorf T, J. Electrochem. Soc., 151(5), C342 (2004)
Luo JK, Chu DP, Flewitt AJ, Spearing SM, Fleck NA, Milne WI, J. Electrochem. Soc., 152(1), C36 (2005)
Jenq SN, Wan CC, Wang YY, J. Electroanal. Chem., 609(2), 68 (2007)
Denn MM, Process fluid mechanics, Prentice-Hall, 1990, p.112.
Dukovic JO, IBM J. Res. Dev., 37, 125 (1993)
Moffat TP, Bonevich JE, Huber WH, Stanishevsky A, Kelly DR, Stafford GR, Josell D, J. Electrochem. Soc., 147(12), 4524 (2000)
Moffat TP, Wheeler D, Edelstein MD, Josell D, IBM J. Res. Dev., 49, 19 (2005)
Newman JS, Electrochemical Systems, Prentice-Hall, Englewood Cliffs, New Jersey, 2nd ed., 1991, p. 331.
