ISSN: 0304-128X ISSN: 2233-9558
Copyright © 2024 KICHE. All rights reserved

Articles & Issues

Language
english
Conflict of Interest
In relation to this article, we declare that there is no conflict of interest.
Publication history
Received November 18, 2016
Accepted December 12, 2016
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.

All issues

Modeling on Hydrogen Effects for Surface Segregation of Ge Atoms during Chemical Vapor Deposition of Si on Si/Ge Substrates

Department of Chemical and Biomolecular Engineering, Seoul National University of Science & Technology, 232, Gongneung-ro, Nowon-gu, Seoul, 01811, Korea
Korean Chemical Engineering Research, April 2017, 55(2), 275-278(4), 10.9713/kcer.2017.55.2.275 Epub 31 March 2017
downloadDownload PDF

Abstract

Heterogeneous semiconductor composites have been widely used to establish high-performance microelectronic or optoelectronic devices. During a deposition of silicon atoms on silicon/germanium compound surfaces, germanium (Ge) atoms are segregated from the substrate to the surface and are mixed in incoming a silicon layer. To suppress Ge segregation to obtain the interface sharpness between silicon layers and silicon/germanium composite layers, approaches have used silicon hydride gas species. The hydrogen atoms can play a role of inhibitors of silicon/germanium exchange. However, there are few kinetic models to explain the hydrogen effects. We propose using segregation probability which is affected by hydrogen atoms covering substrate surfaces. We derived the model to predict the segregation probability as well as the profile of Ge fraction through layers by using chemical reactions during silicon deposition.

References

Moutanabbir O, Gosele U, Annu. Rev. Mater. Res., 40, 469 (2010)
Heyns M, Tsai W, MRS Bull., 34(7), 485 (2009)
Pearsall TP, Bevk J, Feldman LC, Bonar JM, Mannerts JP, Phys. Rev. Lett., 58(7), 729 (1987)
Li JY, Huang CT, Sturm JC, Appl. Phys. Lett., 101(14), 142112 (2012)
Johll H, Samuel M, Koo RY, Kang HC, Yeo YC, Tok ES, J. Appl. Phys., 117(20), 205302 (2015)
Harris JJ, Ashenford DE, Foxon CT, Dobson PJ, Jpyce BA, Appl. Phys. A-Mater. Sci. Process., 33(2), 87 (1984)
Fukatsu S, Fujita K, Yaguchi H, Shiraki Y, Ito R, Appl. Phys. Lett., 59(17), 2103 (1991)
Godbey D, Ancona M, J. Vac. Sci. Technol. B, 11(3), 1120 (1993)
Ohtani N, Mokler S, Xie MH, Zhang J, Joyce BA, Jpn. J. Appl. Phys., 33, 2311 (1994)
Ohtani N, Mokler S, Xie MH, Jhang J, Joyce BA, Surf. Sci., 284(3), 305 (1993)
Ohtani N, Mokler S, Joyce BA, Surf. Sci., 295(3), 325 (1993)
Li Y, Hembree G, Venables JA, Appl. Phys. Lett., 67(2), 276 (1995)
Zaima S, Kato K, Kitani T, Matsuyama T, Ikeda H, Yasuda Y, J. Cryst. Growth, 150, 944 (1995)
Gates SM, Greenlief CM, Beach DB, Holbert PA, J. Chem. Phys., 92(5), 3144 (1990)
Gates SM, Kulkarni SK, Appl. Phys. Lett., 58(25), 2963 (1991)
Park SS, Park JH, Kim SJ, Jung SC, Korean Chem. Eng. Res., 46(6), 1063 (2008)
Hong JH, Kim SH, Hahn YB, Korean Chem. Eng. Res., 42(4), 447 (2004)
Hu XF, Xu Z, Dim D, Downer MC, Parkinson PS, Gong B, Hess G, Ekerdt JG, Appl. Phys. Lett., 71(10), 1376 (1997)

The Korean Institute of Chemical Engineers. F5, 119, Anam-ro, Seongbuk-gu, 233 Spring Street Seoul 02856, South Korea.
Phone No. +82-2-458-3078FAX No. +82-507-804-0669E-mail : kiche@kiche.or.kr

Copyright (C) KICHE.all rights reserved.

- Korean Chemical Engineering Research 상단으로