n-Methylimidazole, acetonitrile, benzylbromide 및 sodiumhexafluoroantimonate를 이용하여 염기성 촉매 1-benzyle-3-mehyl-imidazolium hexafluoroantimonate (BMH)를 합성하고, tetramethyl biphenol (TMBP)과 epichlorohydrine을 이용하여 결정성 바이페닐 에폭시를 합성하여 FT-IR과 1H-NMR으로 구조를 분석하였다. 합성한 촉매 BMH의 경화 거동을 고찰하기 위하여 0 °C 에서 250 °C 까지 5 °C/min의 속도로 승온시키면서 에폭시 수지에 대하여 BMH의 질량비를 0.5, 1.0, 2.0 wt.%로 변화시켜 시차주사 열량계(differential scanning calorimeter, DSC)로 분석하였다. 그 결과, BMH 촉매는 비스페놀 A형 에폭시와 양이온 중합체의 단계적 가열과정에서 빠른 경화 특성을 보였다. 또한 합성한 바이페닐 에폭시는 일정한 온도에서 급격히 점도가 낮아지는 특성과 바이페놀의 강직한 골격구조를 가지는 특성을 가지고 있기 때문에 결정성 구조 및 고내열성을 요구하는 반도체용 봉지재료의 대표격인 epoxy molding compound (EMC)의 원료로서의 적용 가능성을 고찰하였다. 그 결과, 본 연구에서 개발한 바이페닐 에폭시는 결정성 구조로 이루어진 것을 확인하였으며, 경화제로 페놀 노볼락수지와 고온에서의 경화반응 시, BMH 촉매 존재 시에는 150 °C 근처에서 경화반응이 관찰되어 EMC의 원료로 사용될 수 있음을 확인하였다.

The basic catalyst 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was synthesized and analyzed by FT-IR and 1H-NMR. A crystalized biphenyl-based epoxy was synthesized by using tetramethyl biphenol (TMBP) and epichlorohdrine. In order to consider the curing tendency of the synthesized BMH, the mass ratio was changed to 0.5, 1.0, 2.0 wt.% under heated conditions and the curing tendency was analyzed by differential scanning calorimeter (DSC). As a result, the BMH catalyst showed a fast curing result in the stepwise heating process of the biphenol-A epoxy and the cationic polymer. From these results, the BMH catalyst showed excellent thermal stability as a potential heat curing catalyst. In addition, we considered the application possibility of epoxy molding compound (EMC) which required a skeleton structure and a high heat resistance because the synthesized biphenyl epoxy had a characteristic of rapidly lowering viscosity at a constant temperature and a rigid skeleton structure of biphenol. As a result, it was confirmed that the TMBP-based epoxy developed in this study was composed of a crystalline structure, and a curing reaction was observed with a Novolac resin at a high temperature. In the presence of a catalyst, a curing reaction was observed around 150 °C and thus TMBP-based epoxy was successfully applied as a raw material of EMC.

Crystalline epoxy Epoxy molding compound Catalyst Curing behavior Biphenyl epoxy resin

Kim HK, Yoo JH, Chemworld., 38(3), 31 (1998)
Nguyen LT, Gee SA, Bogert WF, J. Electron. Packaging, 397-404 (1991).
Moore T, Mckenna RG, Characterization of Integrated Circuit Packaging Materials, Manning, 274(2013).
Sands P, Principles of International Environmental Law, second ed., Cambridge(2003).
Farren C, Akatsuka Y, Takezawa Y, Itoh Y, Polyemer, 42(4), 1507 (2001)
Kim WG, Kim HS, J. Appl. Polym. Sci., 76(13), 1940 (2000)
Han S, Kim WG, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., 36(5), 773 (1998)
Han S, Yoon HG, Suh KS, Kim WG, Moon TJ, J. Polym. Sci. A: Polym. Chem., 37(6), 713 (1999)
Kim WG, Yoon HG, Lee JY, J. Appl. Polym. Sci., 81(11), 2711 (2001)
Farren C, Akatsuka M, Takezawa Y, Itoh Y, Polyemer., 42(4), 1507 (2001)
Kim WG, Lee JY, J. Appl. Polym. Sci., 86(8), 1942 (2002)
Crivello JV, Lam JH, J. Polym. Sci. A: Polym. Chem., 34(16), 3231 (1996)
Uno H, Takata T, Endo T, J. Polym. Sci. A: Polym. Chem., 27, 1675 (1991)
Hamerton I, Howlin BJ, Jones JR, Liu S, Barton JM, J. Mater. Chem., 6, 30 (1996)
Buist GJ, Hamerton I, Howlin BJ, Jones JR, Liu S, Barton JM, J. Mater. Chem., 4, 1793 (1994)
Ricciardi F, Romanchick WA, Joullie MM, J. Polym. Sci. Polym. Lett Ed., 21, 633 (1983)
Kobayashi M, Sanda F, Endo T, Macromolecules, 32(15), 4751 (1999)
Moriguchi T, Endo T, Takata T, Nakane Y, Macromolecules, 28(12), 4334 (1995)
Wang L, Wong CP, IEEE; Braselton, USA, 67(1999).