ISSN: 0304-128X ISSN: 2233-9558
Copyright © 2025 KICHE. All rights reserved

Overall

Language
korean
Conflict of Interest
In relation to this article, we declare that there is no conflict of interest.
Publication history
Received July 5, 2024
Revised October 3, 2024
Accepted October 22, 2024
Available online February 1, 2025
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright © KIChE. All rights reserved.

Most Cited

교반 속도와 분산제 농도가 세리아 현탁액의 분산효과에 미치는 영향

Influence of Stirring Speed and Concentration on the Dispersibility and Stability of Ceria Suspensions

동국대학교 화공생물공학과
Department of Chemical and Biochemical Engineering, Dongguk University, Seoul, 04620, Korea 1School of Intelligent Manufacturing, Luoyang Institute of Science and Technology, Luoyang 471023, China 2School of Chemistry and Chemical Enginnering, Shandong University of Technology, Zibo 255000, China
pjhoon@dongguk.edu
Korean Chemical Engineering Research, February 2025, 63(1), 59-64(6)
https://doi.org/10.9713/kcer.2025.63.1.59
downloadDownload PDF

Abstract

교반 속도와 분산제 농도가 세리아(CeO2) 연마액의 현탁 정도 및 재분산에 미치는 영향을 조사하고, 최대 14일 방

치하여 세리아의 분산 안정성을 확인하였으며, 분산제 농도를 달리한 현탁액을 제조하여 나노입자 크기 및 분산 안정

성을 분석하였다. 분산제의 농도가 과도하게 첨가되면 세리아 나노입자가 2차 응집되고 부족하면 분산력이 감소한다

는 것이 밝혀졌다. 세 가지 분산제 중 가장 우수한 성능을 보인 분산제 PVP는 세륨 나노입자 분말을 82.1 nm로 분산

시킬 수 있었으며 분산 효과 및 분산 안정성이 가장 뛰어났다. 또한, 분산제를 첨가하지 않고 교반 속도에 변화를 주

어 관찰하였을 때 4000 rpm, pH 3에서 최적의 분산 효과를 얻을 수 있다.

The effects of stirring speed and dispersant concentration on the suspension and redispersion of ceria

(CeO2) polishing liquid was investigated. Sedimentation behavior of ceria was evaluated for up to 14 days, and

dispersion with varying dispersant concentrations were prepared to analyze the size and distribution of nanoparticles. It

was observed that an excessive concentration of dispersant led to secondary aggregation of ceria nanoparticles, while an

insufficient concentration resulted in decreased dispersing power. Among the three dispersants tested, PVP exhibited the

best performance, effectively dispersing cerium nanoparticle powder to an average size of 82.1 nm, thus providing

superior dispersion effect and stability. Furthermore, optimal dispersion was achieved at a stirring speed of 4000 rpm

and a pH of 3 in the absence of a dispersant.

References

1. Cheng, J., Huang, S. and Lu, X., “Preparation of Surface Modified
Ceria Nanoparticles as Abrasives for the Application of
Chemical Mechanical Polishing (CMP),” ECS J. Solid State Sci.
Technol., 9, 024015(2020).
2. Jiao, L., Cui, Y., Chen, Z., Jin, Y. and Lin, N., “Study on the Particles
Classification Control of CeO2 Polishing Powder, in: 9th
International Symposium on Advanced Optical Manufacturing and
Testing Technologies: Advanced Optical Manufacturing Technologies,”
SPIE, pp. 402-407(2019).
3. Luo, X., Yang, W. and Qian, Y., “Fixed Abrasive Polishing: the
Effect of Particle Size on the Workpiece Roughness and Sub-surface
Damage,” Int. J. Adv. Manuf. Technol., 115, 3021-3035(2021).
4. Lu, S., Wang, H., Meng, Y., Wang, F., Fan, M. and Chen, J., “Silica
Nano-particle Anneal Treatment and Its Effect on Chemical
Mechanical Polishing,” J. Electr. Eng. Technol., 14, 355-361(2019).
5. Sorooshian, A., Ashwani, R., Choi, H. K., Moinpour, M., Oehler,
A. and Tregub, A., “Effect of Particle Interaction on Agglomeration
of Silica-Based CMP Slurries,” MRS Online Proceedings
Library., 816, 491-497(2004).
6. Kim, Y., Park, B. and Jeong, H., “Frictional Characteristic of Ceria
Abrasive in Oxide CMP,” Proceedings of the Spring and Fall
Academic Conference of the Korean Society for Precision Engineering,
125-128(2008).
7. Song, X., Jiang, N., Li, Y., Xu, D. and Qiu, G., “Synthesis of
CeO2-coated SiO2 Nanoparticle and Dispersion Stability of Its
Suspension,” Materials Chemistry and Physics., 110, 128-135
(2008).
8. Ye, W., Baoguo, Z., Pengfei, W., Min, L., Dexing, C. and Wenhao,
X., “Improving the Dispersion Stability and Chemical Mechanical
Polishing Performance of CeO2 Slurries,” ECS J. Solid State
Sci. Technol., 12, 044004(2023).
9. Wang, W., Zhang, B., Shi, Y., Zhou, D. and Wang, R., “Improvement
in Dispersion Stability of Alumina Suspensions and Corresponding
Chemical Mechanical Polishing Performance,” Applied
Surface Science., 597, 153703(2022).
10. Gao, R.-J., Yao, Y., Wu, H. and Wang, L., “Effect of Amphoteric
Dispersant on the Dispersion Properties of Nano-SiO2 Particles,”
Journal of Applied Polymer Science., 134, 45075(2017).
11. Ren, D., Zou, Y., Zhan, C.-Y. and Huang, N.-K., “Behaviors of
Different Dispersers on Morphologies of Porous TiO2 Films,”
Front. Mater. Sci. China., 4, 394-397(2010).
12. Agmo Hernández, V., “An Overview of Surface Forces and the
DLVO Theory,” ChemTexts., 9, 10(2023).
13. Lamba, J., Thompson, A. M., Karthikeyan, K. G., Panuska, J. C.
and Good, L. W., “Effect of Best Management Practice Implementation
on Sediment and Phosphorus Load Reductions at
Subwatershed and Watershed Scale Using SWAT Model,” International
Journal of Sediment Research., 31, 386-394(2016).
14. Lestari, M. L. A. D., Müller, R. H. and Möschwitzer, J. P., “Systematic
Screening of Different Surface Modifiers for the Production
of Physically Stable Nanosuspensions,” Journal of Pharmaceutical
Sciences., 104, 1128-1140(2015).
15. Zhuang, X., Magnone, E., Han, S. W. and Park, J. H., “Novel
Surface Modification Strategies for Enhanced CeO2 Nanoparticle
Dispersion and Suspension Stability,” Ceramics International
50(13), 24801-24814(2024).
16. Chorom, M. and Rengasamy, P., “Dispersion and Zeta Potential
of Pure Clays as Related to Net Particle Charge Under Varying
pH, Electrolyte Concentration and Cation Type,” European Journal
of Soil Science, 46(4), 657-665(1995).

The Korean Institute of Chemical Engineers. F5, 119, Anam-ro, Seongbuk-gu, 233 Spring Street Seoul 02856, South Korea.
Phone No. +82-2-458-3078FAX No. +82-507-804-0669E-mail : kiche@kiche.or.kr

Copyright (C) KICHE.all rights reserved.

- Korean Chemical Engineering Research 상단으로