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Conflict of Interest: In relation to this article, we declare that there is no conflict of interest.

Publication history: Received August 11, 2006
Accepted October 12, 2006

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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The use of cubic spline and far-side boundary condition for the collocation solution of a transient convection-diffusion problem

Woohyun Yun Kwang Soon Lee^†

Dept. of Chemical and Biomolecular Engng., Sogang Univ., Shinsoodong-1, Mapogu, Seoul 121-742, Korea

kslee@sogang.ac.kr

Korean Journal of Chemical Engineering, March 2007, 24(2), 204-208(5), 10.1007/s11814-007-5033-0

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Abstract

Cubic spline collocation method with the far-side boundary condition has been proposed as a numerical method for the convection-dominant convection-diffusion problem. It has been shown that the proposed method can give highly accurate result for very large Peclet number problems by effectively suppressing the undesired ripple that is commonly observed in ordinary orthogonal collocation method.

Keywords

Convection-diffusion Problem Boundary Condition Cubic Spline Numerical Solution

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