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- In relation to this article, we declare that there is no conflict of interest.
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Received January 5, 2007
Accepted July 25, 2007
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This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits
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Copyright © KIChE. All rights reserved.
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Reduction of proximity effect in electron beam lithography by deposition of a thin film of silicon dioxide
School of Mechanical and Aerospace Engineering and the Institute of Bioengineering, Seoul National University, Seoul 151-742, Korea
Korean Journal of Chemical Engineering, March 2008, 25(2), 373-376(4), 10.1007/s11814-008-0062-x
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Abstract
We present a simple strategy to reduce the writing time of electron beam lithography (EBL) by using a highly sensitive Shipley’s UV-5 resist while reducing proximity effects by depositing a thin film of silicon dioxide (SiO2) on silicon substrate. It was found that a simple insertion of a thin SiO2 film greatly reduced proximity effects, thereby providing enhanced resolution and better pattern fidelity. To support this conclusion, the bottom line width and sidewall slope of the developed pattern were analyzed for each substrate with different film thickness.
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Thompson LF, Willson CG, Bowden MJ, Introduction to microlithography, 2nd ed, ACS professional reference book, American Chemical Society, Washington, DC (1994)
Stebler C, Despont M, Staufer U, Chang THP, Lee KY, Rishton SA, Microelectronic Engineering, 30, 45 (1996)
Seo E, Choi BK, Kim O, Microelectronic Engineering, 53, 305 (2000)
Wuest R, Strasser P, Jungo M, Robin F, Erni D, Jackel H, Microelectronic Engineering, 67-8, 182 (2003)
Anderson EH, Olynick DL, Chao WL, Harteneck B, Veklerov E, Journal of Vacuum Science & Technology B, 19, 2504 (2001)
Wind SJ, Gerber PD, Rothuizen H, Journal of Vacuum Science & Technology B, 16, 3262 (1998)
Kruger JB, Rissman P, Chang MS, J. Vac. Sci. Technol., 19, 1320 (1981)
Kratschmer E, J. Vac. Sci. Technol., 19, 1264 (1981)
Lee SY, Cook BD, IEEE Transactions on Semiconductor Manufacturing, 11, 108 (1998)
Dobisz EA, Marrian CR, Salvino RE, Ancona MA, Perkins FK, Turner NH, J. Vac. Sci. Technol. B, 11(6), 2733 (1993)
Pan CT, Chen MF, Nanotechnology, 16, 410 (2005)
Wilder K, Quate CF, Singh B, Kyser DF, J. Vac. Sci. Technol. B, 16(6), 3864 (1998)
Rai-Choudhury P, Handbook of microlithography, micromachining, and microfabrication, 2 vols, SPIE Optical Engineering Press, London
Suh KY, Jeong HE, Park JW, Lee SH, Kim JK, Korean J. Chem. Eng., 23(4), 678 (2006)
